• Ultra-high thermal conductivity: Diamond materials have very high thermal conductivity, up to 2000-2500 W/m·K. Compared with ordinary copper plate, the thermal conductivity of diamond copper-clad plate can be 10-20 times higher. This gives it a unique advantage in applications such as heat dissipation of high-power electronic devices.
• Excellent electrical conductivity: By combining the diamond thermal interface layer with the copper substrate, excellent electrical conductivity can be achieved to meet the requirements of electronic equipment for high electrical conductivity.
• Low coefficient of thermal expansion: the coefficient of thermal expansion of diamond is about 1.1×10^-6/°C, much lower than the 17×10^-6/°C of copper. This is beneficial to reduce the material stress and deformation caused by thermal expansion, and improve the reliability of the device.

• High mechanical strength: Diamond materials have ultra-high hardness and compressive strength, which can improve the overall mechanical strength of composite materials. This is important for some electronic devices that are subjected to greater mechanical stress.
• Good insulation: Diamond itself is an excellent insulator and can provide excellent insulation properties in composite materials. This is very helpful for the insulation and isolation of electronic devices.
• Excellent chemical stability: Diamond is chemically very stable and can improve the corrosion resistance of composite materials in a variety of harsh environments.

Technical Parameters

1. Heat dissipation of high-power electronic devices: Because of its ultra-high thermal conductivity, diamond copper-clad plates are widely used in high-power LED, power semiconductor devices, high-speed computer processors and other electronic devices with strict heat dissipation requirements. It can greatly improve the heat dissipation efficiency of the device and extend the service life.

2. High frequency and high speed circuit board: Diamond copper clad plate has excellent conductivity and insulation properties, which is very suitable for 5G communication, radar, military electronics and other high frequency and high speed circuit applications. It can reduce signal delay and distortion and improve system performance.

3. High-density interconnect substrate: Diamond copper-clad plate can achieve high-density wire layout, which is conducive to reducing the size of electronic devices and improving integration. This has important applications in small highly integrated electronic products such as mobile terminals and wearable devices.

4. Aerospace electronics: Diamond copper clad plate has excellent mechanical properties and chemical stability in harsh environments, and is very suitable for application in aerospace electronic equipment, such as satellites, rockets, etc.

5. Power electronics: Diamond copper-clad plates are widely used in high-power electronic equipment such as power electronic converters and charging piles, which can greatly improve the power density and reliability of the equipment.

6. Electromagnetic shielding: Diamond copper clad plates have good electrical conductivity and can be used to manufacture efficient electromagnetic shielding materials to protect electronic devices from interference.

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