Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
Abstract
Fully Automatic Precision Dicing Saw equipment for 8inch 12inch Wafer Cutting
The fully automatic precision dicing saw is an advanced semiconductor cutting system designed for high-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level cutting accuracy (±2μm) with minimal chipping (<5μm), outperforming alternative methods in semiconductor and advanced packaging applications. The system integrates high-rigidity spindles, nanometric positioning stages, and intelligent vision alignment for unmanned operation, meeting the stringent requirements of modern chip manufacturing and third-generation semiconductor processing.
Technical parameters
| Parameter | Specification |
| Working Size | Φ8", Φ12" |
| Spindle | Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm |
| Blade Size | 2" ~ 3" |
| Y1 / Y2 Axis | Single-step increment: 0.0001 mm |
| Positioning accuracy: < 0.002 mm | |
| Cutting range: 310 mm | |
| X Axis | Feed speed range: 0.1–600 mm/s |
| Z1 / Z2 Axis | Single-step increment: 0.0001 mm |
| Positioning accuracy: ≤ 0.001 mm | |
| θ Axis | Positioning accuracy: ±15" |
| Cleaning Station | Rotation speed: 100–3000 rpm |
| Cleaning method: Auto rinse & spin-dry | |
| Operating Voltage | 3-phase 380V 50Hz |
| Dimensions (W×D×H) | 1550×1255×1880 mm |
| Weight | 2100 kg |
Advantages
1. High-speed cassette frame scanning with collision prevention alert system enables rapid precision positioning and superior error correction capability;
2. Innovative dual-spindle synchronous cutting mode increases processing efficiency by 80% compared to single-spindle systems;
3. Premium imported ball screws, linear guides, and Y-axis grating closed-loop control ensure long-term machining stability;
4. Fully automated operation (loading/positioning/cutting/inspection) significantly reduces manual intervention;
5. Unique gantry-style dual-spindle design with minimum 24mm blade spacing accommodates diverse cutting requirements;
Features
1. High-precision non-contact height measurement system;
2. Multi-wafer simultaneous dual-blade cutting capability;
3. Intelligent detection systems (auto-calibration/cut mark inspection/blade breakage monitoring);
4. Multi-mode alignment algorithms adaptable to various process requirements;
5. Real-time position monitoring with automatic error correction;
6. First-cut quality verification mechanism;
7. Customizable factory automation module integration;
Adaptation materials and applications
| Material | Typical Applications | Processing Requirements |
| Aluminum Nitride (AlN) | High-power thermal substrates, LED packaging | Low-stress dicing, delamination prevention |
| PZT Ceramic | 5G filters, SAW devices | High-frequency stability cutting |
| Bismuth Telluride (Bi₂Te₃) | Thermoelectric modules | Low-temperature processing |
| Monocrystalline Silicon (Si) | IC chips | Submicron dicing accuracy |
| Epoxy Molding Compound | BGA substrates | Multilayer material compatibility |
| Cu Pillars/PI Dielectric | WLCSP | Ultra-thin wafer processing |
Machining effect
Q&A
1. Q: What is a fully automatic precision dicing saw used for?
A: It's for high-accuracy cutting of semiconductors (silicon, SiC), ceramics, and fragile materials like glass wafers, achieving micron-level precision with minimal damage.
2. Q: How does automatic dicing improve semiconductor production?
A: Key benefits:99.9% yield with ±2μm accuracy, 50% faster than manual operation, Cuts ultra-thin wafers (<50μm), Zero tool contamination.
Tag: #Fully Automatic Precision Dicing Saw equipment, #8inch 12inch, #Wafer Cutting
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