Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine equipment introduction
Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
The diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine is a high-end system specifically designed for precision processing of hard and brittle materials. It integrates multiple advanced functions including multi-wire parallel cutting (1-3m/s operation speed), sub-micron accuracy (±0.01mm), descending feed mechanism, and dynamic oscillating cutting. The machine is suitable for batch processing of semiconductor wafers, optical components, and special ceramics, supporting various materials such as silicon, silicon carbide (SiC), sapphire (Al₂O₃), and quartz, meeting requirements from R&D to mass production.
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine technical specifications
| Parameter | Specification |
| Project | Multi-line wire saw with workbench on top |
| Maximum workpiece size | ø 204*500mm |
| Main roller coating diameter (Fixed at both ends) | ø 240*510mm (two main rollers) |
| Wire running speed | 2000 (MIX) m/min |
| Diamond wire diameter | 0.1-0.5mm |
| Line storage capacity of supply wheel | 20 (0.25 Diamond wire diameter) km |
| Cutting thickness range | 0.1-1.0mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 250mm |
| Cutting method | The material sways and descends from top to bottom, while the position of the diamond line remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Water tank | 300L |
| Cutting fluid | Anti-rust high-efficiency cutting fluid |
| Swing speed | 0.83°/s |
| Air pump pressure | 0.3-3MPa |
| Swing angle | ±8° |
| Maximum cutting tension | 10N-60N (Set minimum unit 0.1N) |
| Cutting depth | 500mm |
| Workstation | 1 |
| Power supply | Three-phase five-wire AC380V/50Hz |
| Total power of machine tool | ≤92kW |
| Main motor (Water circulation cooling) | 22*2kW |
| Wiring motor | 1*2kW |
| Workbench swing motor | 1.3*1kW |
| Tension control motor (Water circulation cooling) | 5.5*2kW |
| Wire release and collection motor | 15*2kW |
| External dimensions (excluding rocker arm box) | 1320*2644*2840mm |
| External dimensions (including rocker arm box) | 1780*2879*2840mm |
| Machine weight | 8000kg |
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine working principle
- Multi-wire cutting: Utilizes 200+ diamond wires (diameter 0.1-0.3mm) in synchronized motion for batch wafer/material slicing.
- High-speed precision control: Servo motor-driven wire saw (1000-3000m/min) combined with air-bearing spindle (radial runout <0.5μm) ensures stability.
- Descending + oscillating cutting:
- Descending: Vertical workpiece table feed (0.01-10mm/min) minimizes chipping (<10μm).
- Oscillating: Dynamic cutting angle adjustment (±8°) optimizes surface roughness (Ra<0.5μm).
- Intelligent system: Machine vision positioning (5μm accuracy) + adaptive tension control (20-50N adjustable).
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine features and compatible materials
|
Feature
|
Description
|
Material Characteristics
|
|
Multi-wire efficiency
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200-wire simultaneous processing, 5x productivity improvement
|
Silicon ingots (Φ12"), SiC wafers (6")
|
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High-speed precision
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Cutting speed 1-3m/s, accuracy ±0.01mm
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Sapphire (Mohs 9), quartz (low thermal expansion)
|
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Descending+oscillating
|
Reduces material stress, surface roughness Ra<0.5μm
|
Ceramics (AlN/Al₂O₃), optical glass
|
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Intelligent control
|
Real-time monitoring of cutting force/temperature, automatic optimization
|
Composite substrates (SiC-on-Si), special crystals
|
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine technical advantages
- Efficiency: Multi-wire cutting reduces unit cost by 40%, supports 300mm wafer production.
- Quality: Oscillating technology controls chipping <10μm, yield >99.5%.
- Material compatibility: Covers semiconductors (Si/SiC), optoelectronics (sapphire/quartz), and special ceramics.
- Smart manufacturing: IoT remote monitoring + MES system integration for digital production.
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine application fields
1. Semiconductor Manufacturing
- SiC Power Wafer Dicing: Processes 4H-SiC wafers (100-350μm) with <15μm chipping via oscillating cutting, critical for EV inverters and 5G base stations.
- Ultra-Thin MEMS Silicon: Low-stress cutting of <50μm silicon for inertial/pressure sensors, achieving >99% yield.
2. Photovoltaics
- Large Monocrystalline Silicon: Cuts 182/210mm ingots (120-180μm) with 30% wire savings and <2min/wafer throughput, reducing solar module costs.
3. Optoelectronics
- Sapphire Windows: Precision shaped cutting (curved/beveled edges) for smartphone/watch covers (Ra<0.2μm, >92% transmittance).
4. Advanced Materials
- Ceramic Substrates (AlN): Dices high-thermal-conductivity substrates (>170W/m·K) with >95% strength retention for power electronics.
Note: Compatible with Si, SiC, sapphire, quartz, and ceramics. Custom solutions available.
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine FAQ
1. Q: What is the advantage of oscillating cutting in diamond wire saws?
A: Oscillating cutting (±8°) reduces chipping to <15μm and improves surface finish (Ra<0.5μm) for brittle materials like SiC and sapphire.
2. Q: How fast can multi-wire diamond saws cut silicon wafers?
A: With 200+ wires at 1-3m/s, it cuts 300mm silicon wafers in <2 minutes, boosting productivity 5x vs single-wire saws.
Tags: #Diamond Wire Cutting Machine, #Multi-Wire, #High-Speed, #High-Precision,#Descending, #Oscillatin
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