HPSI High Purity Semi-insulating SiC Wafers 2"3"4"6" 8" Prime/Dummy/Research Grade
HPSI-type SiC wafers (High-Purity Semi-Insulating Silicon Carbide) are pivotal optical materials in AI and AR glasses. With a high refractive index (2.6 - 2.7 @ 400 - 800 nm) and low optical absorption characteristics, they effectively address issues such as "rainbow effects" and insufficient light transmittance that are common in traditional glass or resin materials used for AR waveguides. For instance, Meta's Orion AR glasses utilize HPSI SiC waveguide lenses, achieving an ultra-wide field of view (FOV) of 70° - 80° with a single-layer lens thickness of just 0.55 mm and a weight of 2.7 g, significantly enhancing wear comfort and immersion.
- Refractive Index: 2.6 - 2.7
This high refractive index enables the replacement of multi-layer optical structures with a single-layer lens, reducing light loss and enhancing brightness and color accuracy. As a result, it allows for purer visual displays, eliminates rainbow effects, and supports seamless integration with high-resolution Micro LEDs. - Thermal Conductivity: 490 W/m·K
The material rapidly dissipates heat generated by high-power Micro LEDs, preventing lens deformation and extending the device's lifespan. This ensures stable performance even in high-temperature environments, such as outdoor use. - Mohs Hardness: 9.5
With exceptional scratch resistance, the material can withstand daily wear and tear. This reduces maintenance needs and extends the lens's service life, improving long-term usability. - Wide Bandgap Semiconductor
Its compatibility with CMOS processes enables nanoscale lithography and etching for precise optical grating fabrication. This facilitates wafer-scale production of advanced optical components like diffractive waveguides and micro-resonators.
- Waveguide Lenses: The triangular cross-section grating design enables single-layer full-color displays, resolving chromatic dispersion in traditional diffractive waveguides (e.g., Meta Orion solution).
- Micro-Display Couplers: Achieves over 80% light transmission efficiency between Micro LEDs and waveguides.
- Anti-Reflective Coating Substrates: Minimizes environmental light reflections, enhancing AR contrast ratios.
- Quantum Communication Devices: Leverages color center properties for quantum light source integration.
- High-Power Laser Components: Serves as substrates for laser diodes in industrial cutting and medical systems.
| Parameter | Grade | 4-Inch Substrate | 6-Inch Substrate |
|---|---|---|---|
| Diameter | Z Grade / D Grade | 99.5 mm - 100.0 mm | 149.5 mm - 150.0 mm |
| Poly-type | Z Grade / D Grade | 4H | 4H |
| Thickness | Z Grade | 500 μm ± 15 μm | 500 μm ± 15 μm |
| D Grade | 500 μm ± 25 μm | 500 μm ± 25 μm | |
| Wafer Orientation | Z Grade / D Grade | On axis: <0001> ± 0.5° | On axis: <0001> ± 0.5° |
| Micropipe Density | Z Grade | ≤ 1 cm² | ≤ 1 cm² |
| D Grade | ≤ 15 cm² | ≤ 15 cm² | |
| Resistivity | Z Grade | ≥ 1E10 Ω·cm | ≥ 1E10 Ω·cm |
| D Grade | ≥ 1E5 Ω·cm | ≥ 1E5 Ω·cm | |
| Primary Flat Orientation | Z Grade / D Grade | (10-10) ± 5.0° | (10-10) ± 5.0° |
| Primary Flat Length | Z Grade / D Grade | 32.5 mm ± 2.0 mm | Notch |
| Secondary Flat Length | Z Grade / D Grade | 18.0 mm ± 2.0 mm | - |
| Edge Exclusion | Z Grade / D Grade | 3 mm | 3 mm |
| LTV / TTV / Bow / Warp | Z Grade | ≤ 2.5 μm / ≤ 5 μm / ≤ 15 μm / ≤ 30 μm | ≤ 2.5 μm / ≤ 6 μm / ≤ 25 μm / ≤ 35 μm |
| D Grade | ≤ 10 μm / ≤ 15 μm / ≤ 25 μm / ≤ 40 μm | ≤ 5 μm / ≤ 15 μm / ≤ 40 μm / ≤ 80 μm | |
| Roughness | Z Grade | Polish Ra ≤ 1 nm / CMP Ra ≤ 0.2 nm | Polish Ra ≤ 1 nm / CMP Ra ≤ 0.2 nm |
| D Grade | Polish Ra ≤ 1 nm / CMP Ra ≤ 0.2 nm | Polish Ra ≤ 1 nm / CMP Ra ≤ 0.5 nm | |
| Edge Cracks | D Grade | Cumulative area ≤ 0.1% | Cumulative length ≤ 20 mm, single ≤ 2 mm |
| Polytype Areas | D Grade | Cumulative area ≤ 0.3% | Cumulative area ≤ 3% |
| Visual Carbon Inclusions | Z Grade | Cumulative area ≤ 0.05% | Cumulative area ≤ 0.05% |
| D Grade | Cumulative area ≤ 0.3% | Cumulative area ≤ 3% | |
| Silicon Surface Scratches | D Grade | 5 allowed, each ≤1mm | Cumulative length ≤ 1 x diameter |
| Edge Chips | Z Grade | None permitted (width and depth ≥0.2mm) | None permitted (width and depth ≥0.2mm) |
| D Grade | 7 allowed, each ≤1mm | 7 allowed, each ≤1mm | |
| Threading Screw Dislocation | Z Grade | - | ≤ 500 cm² |
| Packaging | Z Grade / D Grade | Multi-wafer Cassette Or Single Wafer Container | Multi-wafer Cassette Or Single Wafer Container |
As an integrated manufacturing and trading entity, ZMSH delivers end-to-end solutions for SiC products:
In-house crystal growth furnaces produce 4H-N, 4H-HPSI, 6H-P, and 3C-N type wafers (2 - 12-inch), with customizable parameters (e.g., doping concentration, bending strength).
- Wafer-Level Cutting: Laser dicing and chemical mechanical polishing (CMP) achieve surface roughness <0.3 nm.
- Custom Shapes: Produces prisms, square wafers, and waveguide arrays for AR optical module integration.
- Contact Us: Samples and technical consultations are available. Full-service support from design validation to mass production.
- 4" 4H-Semi High Purity SiC Wafers Prime Grade Semiconductor EPI Substrates AR Glasses Optical Grade
- 4Inch 4H-N Silicon Carbide SiC Substrate Dia 100mm N type Prime Grade Dummy Grade Thickness 350um Customized
Q1: Why is HPSI SiC Wafer critical for AR glasses?
A1: HPSI SiC Wafer's high refractive index (2.6 - 2.7) and low optical absorption eliminate rainbow effects in AR displays while enabling ultra-thin waveguides (e.g., Meta Orion's 0.55mm lenses).
Q2: How does HPSI SiC differ from traditional glass in AR optics?
A2: HPSI SiC offers twice the refractive index of glass (~2.0), allowing for a wider FOV and single-layer waveguides, plus 490 W/m·K thermal conductivity to manage heat from Micro LEDs.
Q3: Is HPSI SiC compatible with other semiconductor materials?
A3: Yes, it integrates with GaN and silicon in hybrid systems, but its thermal stability and dielectric properties make it superior for high-power AR optics.
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