SiC Coating Machine – Precise Adhesive Deposition for Wafers & Graphite Materials
SiC Coating Machine – Precise Adhesive Deposition for Wafers & Graphite Materials
Product Overview
The SiC Coating Machine is a fully automated, programmable standalone system designed for precise adhesive deposition between wafers, SiC seeds, graphite paper, and graphite plates.
It ensures controlled and uniform coating thickness, preventing local buildup or thin spots, and provides a stable foundation for subsequent vacuum degassing and high-temperature sintering.
Ideal for pilot-scale or medium-to-large batch production, the system supports high repeatability and consistent coating quality.
Key Features
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Precise Coating: Controlled adhesive thickness ensures uniform deposition between wafers, graphite paper, and graphite plates.
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Broad Compatibility: Works with adhesives containing solid particles, supporting a wide range of formulations.
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Automated Operation: Programmable standalone control with coordinated XYZ motion; suitable for batch or pilot-scale production.
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Stable Pre-Treatment: Provides a reliable foundation for subsequent vacuum degassing and high-temperature sintering.
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High Repeatability: Ensures consistent coating across all batches, improving yield and process stability.
Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Machine Dimensions | 920 × 1060 × 1620 mm | Standard model, customizable |
| Effective Coating Area | 500 × 500 mm | Expandable |
| Power Supply | 120V / 220V ±10%, 50–60Hz | Region-dependent |
| Nozzle Type | Ultrasonic, multiple options available | Compatible with various coating thickness requirements |
| Coating Thickness | 20 nm – tens of µm | Precisely controlled, avoids local buildup or thin coating |
| Liquid Flow Rate | 0.006 – 3 ml/s | Depends on solvent and nozzle type |
| Positioning | Laser alignment | Accurate nozzle positioning |
| Motion Control | XYZ coordinated axes, independently programmable | Supports batch or pilot-scale production |
| Liquid Delivery | Constant-flow with online dispersion | Handles solid-containing adhesives, prevents sedimentation |
| Waste Management | Auto-cleaning nozzle, waste liquid recycling, exhaust system | Reduces maintenance cost |
| Heating | Micron-scale vacuum adsorption heating plate, multi-zone control | Suitable for flexible substrates such as battery separators |
| High-Temperature Option | Up to 750°C hot plate | Enables spray pyrolysis thin-film preparation |
Typical Applications
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Semiconductors & SiC Crystal Growth: Seed bonding, wafer preparation
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Conductive & Functional Coatings: SiC, flux, photoresist coatings
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Flexible Substrates & Battery Separators: Handles solid-containing adhesive solutions
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Glass & Photovoltaic Materials: Uniform coating between graphite plates and paper
FAQ – Frequently Asked Questions
Q1: Can the machine handle adhesives containing solids?
A1: Yes. The machine uses high-precision constant-flow delivery with online dispersion, ensuring uniform spraying of solid-containing adhesives without nozzle clogging.
Q2: How precise is the coating thickness control?
A2: Coating thickness ranges from 20 nm to tens of microns, with precise control for uniformity and repeatability.
Q3: What types of substrates are supported?
A3: Wafers, SiC seeds, graphite paper, and graphite plates, including flexible substrates with vacuum-assisted heating.
Q4: Can the machine be used for batch production?
A4: Yes. The XYZ-axis programmable control supports pilot-scale to medium-large batch production, with multi-nozzle parallel operation.
Q5: How is coating uniformity ensured?
A5: Laser alignment, constant-flow delivery, multi-nozzle synchronization, and ultrasonic nozzle technology ensure >95% uniformity.
Q6: Is machine maintenance complicated?
A6: No. The machine is equipped with auto-cleaning nozzles, waste liquid recycling, and exhaust systems, minimizing maintenance requirements.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.