Green Laser Diamond Cutting Machine Precision Cutting for Diamond and Superhard Materials
GREEN LASER Diamond Cutting Machine Precision Cutting for Diamond and Superhard Materials
Product Overview
The Green Laser Diamond Cutting Machine is a compact, precision-oriented laser processing system developed for cutting and slicing of diamond and superhard materials.
The system integrates a 532 nm green laser source, vibration-damping granite base, precision XYZ motion platform, CCD vision assistance, and proprietary programmable control software.
Compared with conventional 1064 nm infrared laser systems, the 532 nm green laser provides higher absorption efficiency, reduced thermal influence, lower graphitization risk, and smoother cutting edges, making it especially suitable for high-value and high-precision diamond processing applications.
Key Features
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532 nm green laser optimized for diamond processing
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Compact mechanical structure designed for precision machining
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Natural granite base for vibration suppression and thermal stability
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High-precision XYZ motion system with excellent repeatability
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CCD vision system for positioning and process monitoring
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Programmable control software developed in-house
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Fully enclosed safety cabinet for industrial laser operation
Technical Parameters
Laser & Motion Specifications
| Item | Specification |
|---|---|
| Laser wavelength | 532 nm |
| Laser power | 20 W @ 10 kHz |
| Cooling method | Water cooling |
| X-axis travel | 150 mm |
| Y-axis travel | 150 mm |
| Z-axis travel | 60–70 mm (configuration dependent) |
| XYZ axis repeatability | ±0.002 mm |
| Maximum platform speed | 500 mm/s |
Environmental & Electrical Requirements
| Item | Specification |
|---|---|
| Operating temperature | 20–25 °C |
| Relative humidity | ≤50% |
| Total power consumption | 1.8–2.0 kW |
| Power supply | 220 V / 50 Hz |
Machine Specifications
| Item | Specification |
|---|---|
| Overall dimensions | 1000 × 900 × 1780 mm |
| Machine weight | 600 kg |
Cutting Performance
| Slice Size (mm) | Max Kerf Width (μm) | Cutting Time (min) | Top-to-Bottom Tolerance (μm) |
|---|---|---|---|
| 7 × 7 | ≤230 | 20 | ≤30 |
| 10 × 10 | ≤320 | 42 | ≤30 |
| 15 × 15 | ≤600 | 160 | ≤30 |
Applicable Materials
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Natural diamond
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Synthetic diamond
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CVD diamond
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PCD / MCD
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CBN
PRODUCT DETAILS
Application Cases
FAQ – Frequently Asked Questions
1. What materials is this green laser cutting machine designed for?
This machine is specifically developed for diamond and superhard materials, including natural diamond, synthetic diamond, CVD diamond, PCD, MCD, and CBN.
The 532 nm green laser offers superior absorption and cutting quality for these materials compared to infrared laser systems.
2. Why is a 532 nm green laser used instead of a 1064 nm infrared laser?
A 532 nm green laser provides:
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Higher absorption by diamond materials
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Smaller heat-affected zone
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Reduced risk of graphitization
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Smoother cutting edges and improved surface quality
These advantages are essential for precision diamond cutting and slicing applications.
3. What level of precision can the machine achieve?
The machine features a precision XYZ motion platform with a repeatability of ±0.002 mm.
The granite base further enhances stability by minimizing vibration and thermal deformation during processing.
4. Is the machine fully automatic?
The system operates with programmable motion control and process automation support.
Workpiece loading and fixture setup are manual, while cutting paths, motion sequences, and process parameters are software-controlled, providing high flexibility and reliability.
5. Is the machine suitable for overseas customers and industrial environments?
Yes.The machine is designed for industrial use and is suitable for international markets. It can be supplied with an English software interface, standard export packaging, and power configuration options according to customer requirements.
Related Product
Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine
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