Customized Zirconia ZrO2 Ceramic Rod High Wear Resistance
8Y-ZrO2 Good quality Customized Zirconia ZrO2 Ceramic Rod
1.ZrO2 Ceramic Rod Technical Data
| PSZ Ceramic Properties | ||
PROPERTIES |
Unit | Zirconia Ceramic |
| Al2O3 (ZrO2 )Content | wt% | ≥ 94 |
| Density |
G /CM3 |
6.00 |
| Hardness (HRA) | HRA ≥ | 90 |
| Flexural Strength | MPa ≥ | 800 |
| Max. use Temperature | ℃ | 1000 |
| Gas-tightness | Pass | |
| Thermal shock Resistance | Pass | |
| Coeff. of Thermal exp. | ×10-6/℃ | 10.0 |
| Volume Resistivity | Ω·cm 20℃ | 1014 |
| Dielectric Strength | KV/mm , DC≥ | 20 |
| Acid Resistance | mg/cm2 ≤ | 2.0 |
| Alkali Resistance | mg/cm2 ≤ | 0.08 |
| Wear ability | g/cm2 ≤ | 0.05 |
| Compressive Strength | M Pa ≥ | 2000 |
| Tensile Strength | M Pa ≥ | 600 |
| Elastic Modulus(Young) | G Pa | 320 |
| Thermal Conductivity | W/m·K( 20℃) | 2.6 |
|
Y-FSZ Ceramic Properties |
||
| Chemical content | ZrO2 | 86 wt% |
| Y2O3 | 14 wt% | |
|
Physical Properties |
Melting point | ≥2500℃ |
| Max. operating temperature | 2200℃ | |
| Color | White | |
| Density | 5.8g/cm3 | |
| Mechanical properties | Flexural strength | 200MPa |
| Young’s module | 200GPa | |
| Hardness(HRA) | 86 | |
| Thermal properties | Thermal expansion coefficient(20℃) | 8-10X10-6 |
| Thermal conductivity | 1-2W/mk | |
| Electrical properties | Dielectric constant(1MHz25℃) | 12 |
| Electrical resistivity(25℃) | 109 | |
decomposition, alkali metal oxidation, lime melting, plasma arc, precipitation, colloid, hydrolysis, spray pyrolysis, etc.
2. Good wear resistance
3. High toughness
4. Low friction coefficient
5. Good corrosion resistance
Application:
Electronical Vacuum decices, Cruibles, Insulation plates, Capacitors, Spaceflights, Traffic,
Weave, Petro Chemical, Mine, Pharmaceutical Engineering, Communication Engineering
and Archtectural, etc.
Our cooperating factory can applied the casting-tape process for the manufacturing of
alumina substrate. With good thermal conductivity, insulation, thermal shock resistance,
well resistance and anti-acid and
alkali etc., our ceramic substrates can be used in thick-film hybrid integrated circuits (HIC),
LED ceramic radiating base, power module, semiconductor devices and other fields.
We applied the casting-tape process for the manufacturing of alumina substrate.
With good thermal conductivity, insulation, thermal shock resistance, well resistance and
anti-acid and alkali etc., our ceramic substrates can be used in thick-film hybrid integrated
circuits (HIC), LED ceramic radiating base, power module, semiconductor devices and other fields.
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