BT FCCSP Package Substrate 3x3mm 0.3mm Thickness Green Soldermask for Flip-Chip Assembly
Price:
US 85-100 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
BT FCCSP Package Substrate Overview
IC substrates serve as critical carrier materials for integrated circuits, providing internal circuitry to connect chips with PCBs while protecting circuits, facilitating heat dissipation, and standardizing IC component modules. These substrates represent one of the most essential materials in IC packaging applications.
Key Specifications
| Parameter | Specification |
|---|---|
| Package Size | 3x3mm |
| Soldermask Color | Green (Customizable) |
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.3mm |
| Copper Weight | 0.5oz (Customizable) |
| Layer Count | 1-6 Layers (Customizable) |
| Flip-Chip Pitch | Up to 35μm |
Material Options
Primary material brands include SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Surface Finish Options
Mainly immersion gold, with customization support for OSP, immersion silver, tin, and additional finishes.
Technical Features
Flip-Chip Assembly
Compatible with flip-chip assembly up to 35μm pitch for peripheral applications
Thin Build-Up Design
0.3mm thickness for 1-2-1 configurations, ideal for System-in-Package (SiP) applications
Environmental Compliance
Halogen-free and lead-free materials for environmentally-friendly products
Application Areas
- IC Assembly and Packaging
- Mobile and Smart Phones
- Digital Camera Electronics
- Semiconductor Packaging
- Consumer Electronics
- Computer Systems
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, operates a 60,000 square meter facility with over $300 million USD investment, producing 600,000 SQM/year of IC substrates using Tenting & SAP processes.
Advanced Technology Support
Line/Space capabilities: 20/20μm, 10/10μm. Support for BT+ABF materials, wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, RF/wireless/bluetooth modules, and various buildup configurations including buried/blind vias.
Inquiry Requirements
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu