0.3mm FCCSP Package Substrate 4L Buildup ENEPIG 5x5mm BT Material 25μm Line/Space
0.3mm FCCSP Package Substrate with 4-layer buildup construction, ENEPIG surface finish, and compact 5×5mm dimensions using high-performance BT material.
| Parameter | Specification |
|---|---|
| Package Type | FCCSP (Flip Chip Chip Scale Package) |
| Substrate Thickness | 0.3mm |
| Layer Count | 4-layer buildup construction |
| Dimensions | 5×5mm |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Material | BT (Bismaleimide Triazine) Material |
| Minimum Line Space/Width | 1mil (25μm) |
| Copper Weight | 0.5oz (standard) or customizable |
| Soldermask | Green (standard) or customizable using TAIYO INK or ABQ brands |
- IC Assembly and Semiconductor Packaging
- Consumer Electronics
- Computer Systems
- Various Electronic Applications
SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others
Immersion gold (standard), OSP, immersion silver, tin, and custom options
1-6 layers available with custom configurations
- MSAP Process: 20/20μm line/space
- Tenting Process: 30/30μm line/space
- Thin Core Technology
- All Type Surface Finish Options
- SR Flatness Process
- Build up / Via Filling Technology
- Tailless, Etch-back Process
- Fine Pitch SOP Process
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi city, Hubei province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters using both Tenting and SAP processes.
For quotation, please provide:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
DHL, UPS, FedEx, air freight, and customized express services available.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.