HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
Verified Supplier
16 Years
Since 2010
Menu
Menu
Home
Products
Show All Products
BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
Medical Equipment PCB
Videos
About Us
Contact Us
Consumer Electronic TV Receivers & Accessories TV Antenna
China FCCSP Package Substrate 4L Buildup with ENEPIG Finish - 0.3mm Thickness, 25μm Line Width for sale

FCCSP Package Substrate 4L Buildup with ENEPIG Finish - 0.3mm Thickness, 25μm Line Width

Price Negotiable
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
FCCSP Package Substrate with ENEPIG Surface Finish
Advanced 4-layer buildup substrate designed for high-performance IC packaging applications with superior electrical performance and reliability.
Applications
IC assembly, semiconductor packaging, consumer electronics, computers, and specialized electronic systems.
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.3mm
Copper Weight 0.5oz or Custom
Layer Count 1-6 Layers (Customizable)
Surface Finish Immersion Gold (ENEPIG), OSP, Immersion Silver, Tin
Soldermask Green or Custom (TAIYO INK, ABQ brands)
Material Options
SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Manufacturing Capabilities
HOREXS-Hubei operates from a 60,000 square meter facility with over $300 million USD investment, producing 600,000 SQM/year of IC substrates using Tenting & SAP processes.
Advanced Technology
  • Line/Space: 20/20μm, 10/10μm
  • BT+ABF materials compatibility
  • Wire bonding substrates (BGA)
  • Embedded memory IC substrates
  • MEMS/CMOS and module substrates (RF, Wireless, Bluetooth)
  • 2/4/6 layer buildup configurations with buried/blind vias
  • Flipchip CSP and ultra IC package substrates
Inquiry Requirements
  • Substrate production specifications
  • Gerber and drilling files
  • Quantity requirements (including samples)
  • Layer stack-up/build-up information for multilayer substrates
Technical Support & Custom Solutions
HOREXS provides comprehensive technical support for high-volume customers, helping optimize costs while maintaining premium quality standards.
Shipping Options
DHL, UPS, FedEx, air freight, and customized express services.
Similar Products
China China FR4 Memory IC Substrate 0.24mm Thickness with 10/10μm Line Width for Semiconductor Packaging for sale for sale

FR4 Memory IC Substrate 0.24mm Thickness with 10/10μm Line Width for Semiconductor Packaging
China China BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging for sale for sale

BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging
China China 0.1mm to 0.4mm Ultra-Thin PCB with 25μm Line Width and 50μm Line Space for Electronics for sale for sale

0.1mm to 0.4mm Ultra-Thin PCB with 25μm Line Width and 50μm Line Space for Electronics
China China IC Substrate Manufacturing - 1-6 Layer Custom Boards with 25μm Line Width & 0.28mm Thickness for sale for sale

IC Substrate Manufacturing - 1-6 Layer Custom Boards with 25μm Line Width & 0.28mm Thickness
China China 0.12mm Ultra-Thin Rigid PCB with 10/10μm Line Width & 12μm Copper - 2 Layer FR4 Circuit Board for sale for sale

0.12mm Ultra-Thin Rigid PCB with 10/10μm Line Width & 12μm Copper - 2 Layer FR4 Circuit Board
China China Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging for sale for sale

Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging
China China 4-Layer MicroSD Card IC Substrate PCB - 0.2mm Thickness, 10/10μm Line/Space, 600,000 SQM Annual Capacity for sale for sale

4-Layer MicroSD Card IC Substrate PCB - 0.2mm Thickness, 10/10μm Line/Space, 600,000 SQM Annual Capacity
China China Custom Ultrathin Rigid PCB Fabrication with 25μm Line Width and 0.1-0.4mm Thickness for IC Substrate Applications for sale for sale

Custom Ultrathin Rigid PCB Fabrication with 25μm Line Width and 0.1-0.4mm Thickness for IC Substrate Applications
China China BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness for sale for sale

BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness
China China eMMC IC Package Substrate PCB - 0.2mm FR4 BGA with 1mil Line Width for Semiconductor Assembly for sale for sale

eMMC IC Package Substrate PCB - 0.2mm FR4 BGA with 1mil Line Width for Semiconductor Assembly
China China 0.4mm Ultrathin Rigid PCB with 25μm Line Width and 100μm Hole Size for Memory Electronics for sale for sale

0.4mm Ultrathin Rigid PCB with 25μm Line Width and 100μm Hole Size for Memory Electronics
China China BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability for sale for sale

BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.