4-Layer IC Substrate BT Material with 25μm Line Width and 0.22mm Thickness for Semiconductor Packaging
Price:
US 99-120 each piece
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
IC Substrate Manufacturing Specifications
Applications
- Semiconductor and IC package substrates
- IC substrate manufacturing
- Wearable electronics
- IC assembly systems
- Storage IC substrates
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.22mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Mainly immersion gold, customizable options including OSP/immersion silver, tin, and more |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green or customizable (Brand: TAIYO INK) |
Manufacturing Capabilities
HOREXS Manufacturing Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi city, Hubei province, China. Our facility spans over 60,000 square meters with an investment exceeding $300 million USD.
Production Capacity
- Annual IC Substrate Capacity: 600,000 SQM/Year
- Process Technologies: Tenting & SAP process
- Advanced Capabilities: L/S 20/20μm, 10/10μm
- Material Support: BT+ABF materials
Technology Support
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology (Buried/Blind hole)
- Flipchip CSP and other ultra IC package substrates
Inquiry Requirements
To provide accurate pricing and technical support, please include the following information with your inquiry:
- Substrate production specifications
- Gerber files and drilling files (exported from layout software)
- Quantity requirements including samples
- For multilayer substrates: layer stack-up information
Get Better Pricing & Quality
Large volume customers receive additional technical support and cost-saving solutions. Contact HOREXS today for competitive pricing and high-quality IC substrate manufacturing.
Shipping Options
- Express: DHL, UPS, FedEx
- Air freight
- Custom express services (DHL/UPS/FedEx)
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu