HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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16 Years
Since 2010
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Custom Ultrathin Rigid PCB Fabrication with 25μm Line Width and 0.1-0.4mm Thickness for IC Substrate Applications

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
Product Overview
High-quality gold plating ultrathin printed circuit board fabrication with customizable BT FR4/IC substrate materials. Specialized in precision manufacturing for advanced electronic applications.
Applications
  • DRAM memory electronics
  • SD card, memory card, MicroSD, MicroTF card
  • Flash memory card, DDR memory
  • Semi Package, Semiconductors, IC package
  • IC substrate, MCP, UFS, CMOS, MEMS
  • IC assembly, Storage IC substrate
PCB Production Specifications
Technical Capabilities
Item Mass Production Sample Notes
Minimum Line Space/Width 25μm (1mil) 25μm (1mil)
Hole Size 100μm 100μm Finished hole size
Bonding Finger Pitch 105μm 95μm
Pattern Pitch 95μm 90μm
Line Width 25μm 25μm
Line Space 25μm 25μm
Hole Ring (PTH) 80μm 80μm
Thickness (Double Side) 100μm 100μm Finished board size
Thickness (Multilayer) 4L: 300μm 4L: 240μm
Line or PAD to Board Edge 100μm 100μm
Solder Mask Window 50μm 50μm
Solder Mask Bridge 80μm 70μm
Material Options
  • Material Brands: SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
  • Surface Finish: Mainly immersion gold, also supports OSP, immersion silver, tin, and custom options
  • Copper: 0.5oz or customizable
  • Layers: 1-6 layers (customizable)
  • Soldermask: Green or customizable (Brands: TAIYO INK, ABQ)
Surface Treatment Technology
Type Layer Minimum Maximum Application
Immersion Gold Ni 2.54μm 6.0μm BGA
Immersion Gold Au 0.03μm 0.50μm BGA
Plating Gold Ni 5μm 10μm Bonding finger
Plating Gold Au 0.3μm 0.6μm Bonding finger
OSP OSP 0.25μm 0.5μm BGA
Hole Wall Cu 10μm 20μm
Manufacturer Capabilities
HOREXS is a whole process ultra thin FR4 PCB manufacturer in China, specializing in thin FR4 PCB and IC substrate production. With advanced Japanese production equipment including AVI, AOI inspection systems, 3 LDI machines for soldermask and circuit lines, and Mekki brand laminate press machines, we achieve quality yields exceeding 99.7% with stable quality guarantee.
Inquiry Requirements
  • PCB production specification information
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer thin FR4 PCBs
Shipping Support
DHL, UPS, FedEx, and air freight services available.
Contact Information
For large volume customers requiring technical support and cost optimization, contact HOREXS for customized solutions. Our mission is to help you save costs while maintaining high quality standards.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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