RF Module Substrate with Impedance Control - 0.21mm Thickness, 1mil Line Width, 1-6 Layer BT Material
Price:
US 0.089-0.109 each piece
MOQ:
1000pieces
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
RF Module Substrate with Impedance Control
Application: Semiconductor packaging, IC packaging, WIFI/Bluetooth modules, and other advanced electronic applications requiring precise impedance control.
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (35μm) |
| Finished Thickness | 0.21mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), customizable options including OSP, immersion silver, tin |
| Copper Weight | 0.5oz or customizable |
| Layers | 1-6 layers (customizable) |
| Soldermask | Green (standard), customizable colors using TAIYO INK or ABQ brands |
Manufacturing Capabilities
- Advanced IC substrate manufacturing with 60,000 sqm annual capacity
- Line/space capability: 20/20μm, 10/10μm
- BT+ABF material processing expertise
- Support for wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, and RF/wireless/bluetooth modules
- Multilayer configurations: 2/4/6 layers (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP and advanced IC packaging solutions
Inquiry Requirements
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
Shipping & Logistics
Global shipping support via DHL, UPS, FedEx, and air freight services with customized express options.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu