HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China BT Semiconductor IC Packaging Substrate 0.35mm Thickness 25μm Line Width 1-6 Layer Custom Manufacturing for sale
China BT Semiconductor IC Packaging Substrate 0.35mm Thickness 25μm Line Width 1-6 Layer Custom Manufacturing for sale
China BT Semiconductor IC Packaging Substrate 0.35mm Thickness 25μm Line Width 1-6 Layer Custom Manufacturing for sale

BT Semiconductor IC Packaging Substrate 0.35mm Thickness 25μm Line Width 1-6 Layer Custom Manufacturing

Price Negotiable
Price: US 85-120 each square meter
MOQ: 10 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
BT Semiconductor IC Packaging Substrate Manufacturing
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer in China with advanced production capabilities including 600,000 SQM annual capacity and 20/20μm line space/width technology.
Applications
DRAM memory electronics, SD cards, memory cards, MicroSD, MicroTF cards, Flash memory cards, DDR, semiconductor packages, IC substrates, MCP, UFS, CMOS, MEMS, IC assembly, storage IC substrates, NAND/Flash memory, and various IC packaging solutions.
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1mil (25μm)
Finished Thickness 0.35mm
Copper Weight 0.5oz or Customized
Layers 1-6 layers (Customized)
Material Brands SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish Immersion gold (standard), OSP, immersion silver, tin (customized)
Soldermask Green or Customized (TAIYO INK, ABQ brands)
Manufacturing Capabilities
  • 60,000 square meter facility in Huangshi City, Hubei Province
  • $300 million USD investment
  • 600,000 SQM annual IC substrate capacity
  • Tenting & SAP processes
  • Advanced L/S 20/20μm, 10/10μm technology
  • BT+ABF materials support
  • Wire bonding substrates (BGA)
  • Embedded memory IC substrates
  • MEMS/CMOS modules
  • RF, Wireless, Bluetooth modules
  • 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
  • Buildup technology with buried/blind vias
  • Flipchip CSP packaging
Inquiry Requirements
For accurate quotations and technical support, please provide:
  • Substrate production specifications
  • Gerber files and drilling files
Shipping & Logistics
DHL, UPS, FedEx, air freight, and customized express services available.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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