IC Substrate PCB Manufacturing - 0.2mm Thickness, 10/10μm Line/Space, 600,000 SQM Annual Capacity
IC substrate PCBs serve as critical carrier materials for memory integrated circuits, featuring internal circuitry that connects chips to PCBs. These substrates provide circuit protection, specialized line routing, optimized heat dissipation, and standardized IC component modules, making them essential for memory IC packaging applications.
- DRAM memory electronics
- MicroSD and MicroTF cards
- Semiconductor packaging
- IC package substrates
- SD cards and memory cards
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.2mm |
| Raw Materials | SHENGYI, Mitsubishi, mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 Layer |
| Soldermask/PSR | Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700,300 series |
HOREXS-Hubei, part of HOREXS Group, operates from a 60,000 square meter facility with over $300 million USD investment. Annual IC substrate production capacity reaches 600,000 square meters using Tenting & SAP processes.
Advanced Technology: Line/Space 20/20μm, 10/10μm with BT+ABF materials
Supported Processes: Wire bonding substrates, embedded memory IC substrates, MEMS/CMOS modules, RF/wireless/Bluetooth modules, buildup with buried/blind vias, Flipchip CSP
No Minimum Order Quantity: No MOQ/MOV requirements for any clients
Production Capacity: 15,000 sqm/month (Guangdong) + 50,000 sqm/month (Hubei)
FCBGA Development: Planned for 2024-2025 implementation
Contact Person: AKEN
Email: akenzhang@horexspcb.com
Required Documents: Gerber files, production specifications, buildup/stackup information for multilayer substrates
- DHL / UPS / FedEx
- Air freight / Sea freight
- Custom express services
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