Camera Module IC Substrate PCB 0.2mm Thickness with 10/10μm Line Width for Electronics Manufacturing
Ultra-thin FR4 PCB boards specifically engineered for camera electronics applications including CCD cameras and camera modules. These substrates feature exceptional precision and reliability for demanding imaging systems.
- Camera electronics and imaging systems
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.2mm |
| Raw Material | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 Layer |
| Soldermask/PSR | Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700,300 series |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with 60,000 square meters of production space and over $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes.
Advanced technology includes L/S 20/20μm, 10/10μm, BT+ABF materials. Supports wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, RF/wireless/Bluetooth modules, and various buildup configurations.
- No minimum order quantity (MOQ) requirements
- High-volume production capacity: 15,000 SQM/month (Guangdong) + 50,000 SQM/month (Hubei)
- FCBGA package substrate production planned for 2024-2025
Contact: AKEN | Email: akenzhang@horexspcb.com
Required for quotation: Gerber files, production specifications, buildup/stackup information for multilayer substrates.
- DHL / UPS / FedEx
- Air freight / Sea freight
- Custom express services available
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