HOREXS Semiconductor IC Package Substrate with 25μm Line Width and 0.29mm Thickness for Wire Bonding Applications
Price:
Depend on customized spec.
MOQ:
Sample or Mass production
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
HOREXS Semiconductor IC Package Substrate with Chip Wire Bonding
Professional IC substrate solutions for advanced semiconductor packaging applications including memory cards, UDP, and bonding PCB printed circuit boards.
Key Applications
- Memory cards (MicroSD, MicroTF, UDP)
- Semiconductor IC packaging and assembly
- Wearable electronics
- NAND/Flash memory packaging
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
Substrate Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.29mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (customizable: OSP, immersion silver, tin) |
| Copper | 0.5oz or customizable |
| Layers | 4 layers (customizable) |
| Soldermask | Green or customizable (TAIYO INK brand) |
Manufacturing Capabilities
- Factory area: 60,000 square meters
- Investment: $300 million USD
- Annual capacity: 600,000 square meters
- Advanced processes: Tenting & SAP
- Fine line technology: L/S 20/20μm, 10/10μm
- Material support: BT+ABF materials
Technical Support
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP packaging
Inquiry Requirements
For accurate quotation and technical support, please provide:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
Shipping & Logistics
We support worldwide shipping via DHL, UPS, FedEx, and air freight services.
HOREXS Mission: Help you save costs while maintaining high quality standards with comprehensive technical support for large-scale customers.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu