HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China IC Substrate PCB for MicroSD Cards with 0.2mm Thickness and 10/10μm Line/Space Capability for sale
China IC Substrate PCB for MicroSD Cards with 0.2mm Thickness and 10/10μm Line/Space Capability for sale
China IC Substrate PCB for MicroSD Cards with 0.2mm Thickness and 10/10μm Line/Space Capability for sale

IC Substrate PCB for MicroSD Cards with 0.2mm Thickness and 10/10μm Line/Space Capability

Price Negotiable
Price: US 120-150 per square meter
MOQ: 100pieces
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
IC Substrate PCB for Memory Integrated Circuits
IC substrate PCBs serve as essential carrier materials for memory integrated circuits, featuring internal circuitry that connects chips to PCBs. These substrates provide circuit protection, specialized line routing, optimized heat dissipation, and standardized IC component modules. As a critical material in memory IC packaging, IC substrates play a vital role in semiconductor applications.
Applications
  • DRAM memory electronics
  • MicroSD and MicroTF cards
  • Semiconductor packaging
  • SD cards and memory cards
  • Semi-package components
Technical Specifications
Parameter Specification
Minimum Line Space/Width 35/35μm - 20/20μm - 10/10μm
Finished Thickness 0.2mm
Copper Thickness 12μm
Layers 2 layers
Raw Materials SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finishes ENIG, ENEPIG, OSP, Soft Gold, Hard Gold
Soldermask/PSR Green Taiyo brand, AUS 308, AUS 320, AUS 410, SR-1700, 300 series
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with over 60,000 square meters of production space and $300 million USD investment. Annual capacity reaches 600,000 square meters with Tenting & SAP processes. Advanced technology supports line/space down to 10/10μm with BT+ABF materials.
Production Support
  • Wire bonding substrates (BGA)
  • Embedded memory IC substrates
  • MEMS/CMOS modules
  • RF, Wireless, Bluetooth modules
  • 2/4/6 layer buildup structures
  • Flipchip CSP packaging
Business Information
Contact Details
Contact: AKEN
Email: akenzhang@horexspcb.com
Support: Roadmap/design rules files, production capability files
Shipping Options
  • DHL, UPS, FedEx express shipping
  • Air freight and sea freight
  • Custom express services
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Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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