BGA IC Package Substrate with 0.29mm Thickness and 25μm Line Width - MGC BT Material for Semiconductor Packaging
Price:
Depend on customized spec.
MOQ:
Sample or Mass production
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
BGA IC Package Substrate with Cap Plated MGC BT Material
Product Overview
High-performance IC substrate designed for advanced semiconductor packaging applications including memory cards, wearable electronics, and NAND/Flash memory packages.
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 4 layers (Customizable) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (Customizable: OSP, Immersion silver, tin) |
| Soldermask | Green or Customized (TAIYO INK brand) |
Applications
- Memory cards (MicroSD, MicroTF)
- Semiconductor IC packaging and assembly
- Wearable electronics
- NAND/Flash memory packages
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
Manufacturing Capabilities
HOREXS-Hubei Facility: 60,000 sqm manufacturing space with $300 million USD investment
Annual Capacity: 600,000 SQM of IC substrates
Advanced Technology: L/S 20/20μm, 10/10μm with BT+ABF materials
Process Support: Tenting & SAP processes
Required Information for Quotation
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
Get Started Today
Contact HOREXS for competitive pricing, superior quality substrates, and technical support. Our mission is to help you save costs while maintaining high quality standards.
Shipping Options: DHL, UPS, FedEx, Air freight
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu