Wire Bonding Memory Substrate with Gold Plating - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Package
Price:
US 160-175 per square meter
MOQ:
10 squre meters
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Wire Bonding Memory Substrate with Gold Plating
Applications
IC package, Semiconductor package, Memory electronics, NAND/Flash memory applications
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.18mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 1-6 Layers (Customized) |
| Surface Finish | Mainly immersion gold, supports OSP/immersion silver, tin, and custom options |
| Soldermask | Green or Customized (Brands: TAIYO INK, ABQ) |
Material Brands
SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others
Manufacturing Capabilities
- IC Substrate Capacity: 600,000 SQM/Year
- Advanced Technology: L/S 20/20μm, 10/10μm
- Material Support: BT+ABF materials
- Process Capabilities: Tenting & SAP process
Product Support
- Wire Bonding Substrate (BGA)
- Embedded Memory IC Substrate
- MEMS/CMOS, Module (RF, Wireless, Bluetooth)
- 2/4/6 Layer Configurations (1+2+1/2+2+2/1+4+1)
- Buildup (Buried/Blind Hole) Flipchip CSP
- Other Ultra IC Package Substrate Solutions
Inquiry Requirements
- Substrate production specification information
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/buildup information
Shipping & Support
DHL/UPS/FedEx, Air freight, and customized express services available. Technical support provided for large volume customers.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu