Hard Golden Finger SD Card PCB with 25μm Line Width and 0.1-0.4mm FR4 Thickness for Memory Card Applications
High-precision SD card circuit boards featuring hard golden finger contacts designed for reliable plug-in and removal operations. These PCBs are engineered for memory card applications requiring superior durability and electrical performance.
- SD cards and memory cards
- MicroSD and MicroTF cards
- Flash memory cards and DDR modules
- Semiconductor packaging and IC substrates
- MCP, UFS, CMOS, and MEMS devices
- Storage IC substrates and IC assemblies
- Minimum line space/width: 1mil (25μm)
- Finished thickness: FR4 (0.1-0.4mm)
- Material brands: SHENGYI, Mitsubishi, OhmegaPly, Rogers, and others
- Surface finishes: Immersion gold (standard), OSP, immersion silver, tin
- Copper: 0.5oz or customizable
- Layers: 1-6 layers (customizable)
- Soldermask: Green standard or customizable colors
| Item | Mass Production | Sample | Notes |
|---|---|---|---|
| Hole Size | 100μm | 100μm | Finished hole size |
| Bonding Finger Pitch | 105μm | 95μm | |
| Pattern Pitch | 95μm | 90μm | |
| Line Width/Space | 25μm | 25μm | |
| Hole Ring (PTH) | 80μm | 80μm | |
| Thickness (Double Side) | 100μm | 100μm | Finished board size |
| Thickness (4-Layer) | 300μm | 240μm | |
| Line/PAD to Board Edge | 100μm | 100μm | |
| S/M Window | 50μm | 50μm | |
| S/M Bridge | 80μm | 70μm |
| Type | Component | Min Thickness | Max Thickness | Application |
|---|---|---|---|---|
| Immersion Gold | Ni | 2.54μm | 6.0μm | BGA |
| Immersion Gold | Au | 0.03μm | 0.50μm | BGA |
| Plating Gold | Ni | 5μm | 10μm | Bonding Finger |
| Plating Gold | Au | 0.3μm | 0.6μm | Bonding Finger |
| OSP | OSP | 0.25μm | 0.5μm | BGA |
| Hole Wall | Cu | 10μm | 20μm |
HOREXS is a leading ultra-thin FR4 PCB manufacturer in China, specializing in IC substrate production. With Japanese precision equipment, automated optical inspection systems, and LDI technology, we maintain exceptional quality standards with yields exceeding 99.7%. Our capabilities support advanced applications including smart cards, sensors, BGA packages, and memory modules.
- PCB production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer boards
For high-volume customers, HOREXS provides comprehensive technical support and cost optimization solutions. Contact us for superior quality PCBs at competitive pricing.
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