IC Substrate Manufacturing 0.17mm Thickness 25μm Line Width for Semiconductor Electronics
Price:
US 0.1-0.12 each piece
MOQ:
1000pieces
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
IC Substrate Manufacturing Specifications
Applications
- Fingerprint recognition electronics
- IoT electronics
- Semiconductors and IC packaging
- Consumer electronics
- Automotive electronics
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.17mm |
| Copper Weight | 0.5oz or Customizable |
| Layers | 1-6 layers (Customizable) |
| Soldermask | Green or Customizable (TAIYO INK, ABQ brands) |
Material Brands
Primary brands include SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Surface Finishes
Primarily immersion gold, with customization options including OSP, immersion silver, tin, and more.
Manufacturing Capabilities
HOREXS-Hubei operates from a 60,000 square meter facility with over $300 million USD investment. Annual IC substrate production capacity reaches 600,000 square meters using Tenting & SAP processes.
Advanced Technology Support
- Line/Space: 20/20μm, 10/10μm
- BT+ABF materials
- Wire bonding substrates (BGA)
- Embedded memory IC substrates
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup with buried/blind vias
- Flipchip CSP and ultra IC package substrates
Inquiry Requirements
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Shipping Options
DHL, UPS, FedEx, air freight, and customized express services.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu