HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China 4 Layer MicroSD Card IC Substrate with 10/10μm Line Width and 0.26mm Thickness for Memory Packaging for sale
China 4 Layer MicroSD Card IC Substrate with 10/10μm Line Width and 0.26mm Thickness for Memory Packaging for sale
China 4 Layer MicroSD Card IC Substrate with 10/10μm Line Width and 0.26mm Thickness for Memory Packaging for sale

4 Layer MicroSD Card IC Substrate with 10/10μm Line Width and 0.26mm Thickness for Memory Packaging

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
IC substrate is an essential advanced packaging material for memory integrated circuits, featuring internal circuitry that connects chips to PCBs. This substrate protects circuits and specialized lines while providing optimized heat dissipation and serving as a standardized module for IC components. It represents one of the most critical materials in memory IC packaging.
Applications
  • DRAM memory electronics
  • NAND flash memory
  • MicroSD and MicroTF cards
  • Semiconductor packaging
  • SD cards and memory cards
Technical Specifications
Minimum Line Space/Width 35/35μm - 20/20μm - 10/10μm
Finished Thickness 0.26mm
Raw Materials SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish ENIG, ENEPIG, OSP, Soft Gold, Hard Gold
Copper Thickness 12μm
Layers 2 layer
Soldermask/PSR Green Taiyo brand, AUS 308, AUS 320, AUS 410, SR-1700, 300 series
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, is a leading Chinese IC substrate manufacturer with over 60,000 square meters of production space and $300 million USD investment. Annual IC substrate capacity reaches 600,000 square meters using Tenting & SAP processes. The company specializes in advanced technologies including L/S 20/20μm and 10/10μm, BT+ABF materials, and supports various packaging types including wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, and module applications.
Production Capacity
Old factory: 15,000 sqm/month | New factory: 50,000 sqm/month
Shipping Options
  • DHL, UPS, FedEx
  • Air freight and sea freight
  • Custom express services
Contact Information
Contact: AKEN
Email: akenzhang@horexspcb.com
Support: Technical roadmap, design rules, production capability files
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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