Custom Black Memory IC Substrate for Memory Cards - 0.18mm Thickness, 12μm Copper, 2 Layer Design
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Product Overview
Custom black memory IC substrate designed specifically for memory card applications. This semiconductor packaging substrate serves as a critical carrier material that connects integrated circuit chips to PCBs while providing circuit protection, specialized routing, heat dissipation, and standardized IC component modules.
Applications
- NAND memory systems
- Flash memory devices
- Smart electronics
- Mobile phones and digital electronics
- SD cards and memory cards
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.18mm |
| Raw Materials | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 layers |
| Soldermask/PSR | Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700, 300 series |
Manufacturer Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters using Tenting & SAP processes. The company specializes in advanced technologies including L/S 20/20μm and 10/10μm, BT+ABF materials, and supports various packaging types including wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, and RF/wireless/bluetooth modules.
Production Capabilities
Total Capacity: 65,000 SQM/month across two factories
Technology: 2/4/6 layer buildup with buried/blind vias
Packaging Support: Flipchip CSP and other ultra IC package substrates
Technology: 2/4/6 layer buildup with buried/blind vias
Packaging Support: Flipchip CSP and other ultra IC package substrates
Frequently Asked Questions
Where are HOREXS factories located?
HOREXS Group operates two facilities: one in Huizhou City, Guangdong Province and another in Hubei Province.
Is there a minimum order quantity?
No minimum order quantity (MOQ) or minimum order value (MOV) requirements.
Can HOREXS handle large volume production?
Yes, with combined monthly capacity of 65,000 square meters across both factories.
Who should I contact for cooperation?
Contact: AKEN
Email: akenzhang@horexspcb.com
Provides support for roadmap/design rules files and production capability documentation.
Email: akenzhang@horexspcb.com
Provides support for roadmap/design rules files and production capability documentation.
Does HOREXS provide IC package design services?
No, we focus exclusively on semiconductor IC substrate manufacturing, though we can connect clients with design partners.
What information is needed for quotation?
- Gerber files
- Production specifications
- Buildup/stackup information for multilayer substrates
- Additional supporting documentation
Can HOREXS produce FCBGA package substrates?
FCBGA substrate manufacturing is planned to begin in 2024 or 2025.
Special Note for Large Customers: Please share detailed requirements for customized technical support. HOREXS is committed to helping clients reduce costs while maintaining high quality standards.
Shipping Options
- DHL / UPS / FedEx
- Air freight / Sea freight
- Custom express services using company accounts
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu