IC Substrate PCB for Flash Memory - 0.2mm Thickness with 10/10μm Line/Space Capability
IC substrate is an advanced semiconductor packaging technology developed from HDI board foundations. As a high-end PCB solution, it features exceptional density, precision, miniaturization, and thin profile characteristics. These substrates serve as packaging carriers that replace traditional lead frames, providing chip support, heat dissipation, protection, and electronic connectivity between chips and motherboard PCBs.
- DRAM devices
- MicroSD and MicroTF cards
- DDR memory
- Flash memory systems
- NAND memory solutions
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.2mm |
| Copper Thickness | 12μm |
| Layer Count | 2 layers |
| Raw Materials | SHENGYI, Mitsubishi, mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | ENIG, ENEPIG, OSP, Soft Gold, Hard Gold |
| Soldermask/PSR | Green Taiyo brand, AUS 308, AUS 320, AUS 410, SR-1700, 300 series |
HOREXS-Hubei, part of HOREXS Group, operates from a 60,000 square meter facility with over $300 million USD investment. Annual IC substrate capacity reaches 600,000 square meters using Tenting & SAP processes. Advanced technology supports line/space down to 10/10μm with BT+ABF materials for various packaging applications including wire bonding, embedded memory IC substrates, MEMS/CMOS, and RF modules.
Contact Person: AKEN
Email: akenzhang@horexspcb.com
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