IC Substrate PCB Manufacturing - 10/10μm Line Width, 0.26mm Thickness, 600,000 SQM Annual Capacity
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
IC Substrate PCB Overview
IC substrate, also known as packaging substrate, serves as a critical raw material for integrated circuit packaging. It provides electrical signal transmission for chip connectivity while offering essential support for heat dissipation and component protection. Developed from HDI board technology, IC substrates are categorized by packaging modes including BGA, CSP, FC, and MCM packaging substrates.
Primary Applications
- DRAM electronics and memory systems
- MicroSD and MicroTF card manufacturing
- Semiconductor packaging and IC assembly
- SD card and memory card production
- Advanced semiconductor IC packaging solutions
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.26mm |
| Raw Materials | SHENGYI, Mitsubishi, mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG, ENEPIG, OSP, Soft Gold, Hard Gold |
| Copper Thickness | 12μm |
| Layer Count | 2 Layer |
| Soldermask/PSR | Green Taiyo brand, AUS 308, AUS 320, AUS 410, SR-1700, 300 series |
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, stands as a leading and rapidly expanding IC substrate manufacturer in China. Located in Huangshi city, Hubei province, the facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters utilizing advanced Tenting & SAP processes.
Technical Support & Services
HOREXS specializes in wire bonding substrates, embedded memory IC substrates, MEMS/CMOS modules, and various buildup configurations including 2/4/6 layer designs with buried/blind via technology. The company supports Flipchip CSP and other ultra IC package substrate requirements.
Frequently Asked Questions
Company Locations
HOREXS operates two manufacturing facilities: an established factory in Huizhou city, Guangdong, and a new advanced facility in Hubei province.
Order Requirements
No minimum order quantity (MOQ) or minimum order value (MOV) restrictions. Production capacity includes 15,000 sqm/month from the Guangdong facility and 50,000 sqm/month from the Hubei facility.
Quotation Requirements
For accurate pricing, please provide Gerber files, production specifications, buildup/stackup information for multilayer substrates, and any additional relevant documentation.
Technical Limitations
HOREXS focuses exclusively on semiconductor IC substrate manufacturing and does not provide IC package or IC design services. FCBGA package substrate production is scheduled to begin in 2024-2025.
Contact Information
For technical cooperation and inquiries, contact AKEN at email: akenzhang@horexspcb.com. Comprehensive support includes roadmap documentation, design rules files, and production capability specifications.
Shipping & Logistics
Global shipping options available through DHL, UPS, FedEx via air freight or sea transport. Custom express shipping arrangements supported using company accounts with major carriers.
For high-volume customers requiring technical support, HOREXS provides comprehensive assistance to optimize cost efficiency while maintaining superior quality standards. Our mission is to deliver exceptional value through advanced IC substrate manufacturing solutions.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu