High-Capacity Memory IC Substrate Manufacturing - 0.1mm Thickness, 25μm Line Width, 600,000 SQM Annual Capacity
Flash memory packaging, NAND memory substrate packages, memory electronics, and semiconductor packaging solutions.
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.1mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 1-6 layers (Customizable) |
| Surface Finish | Primarily immersion gold, with customization options including OSP, immersion silver, tin, and more |
| Soldermask | Green or Customized (Brands: TAIYO INK, ABQ) |
Primary materials include SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with investments exceeding $300 million USD.
Annual IC substrate capacity: 600,000 SQM utilizing Tenting & SAP processes
- Line/Space: 20/20μm, 10/10μm capabilities
- BT+ABF material processing
- Wire bonding substrates (BGA)
- Embedded memory IC substrates
- MEMS/CMOS and module substrates (RF, Wireless, Bluetooth)
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP and other ultra IC package substrates
For accurate quotations and production planning, please provide:
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including sample requests
- For multilayer substrates: layer stack-up/build-up information
We support worldwide shipping via DHL, UPS, FedEx, air freight, and customized express services.
For superior pricing and quality IC substrates with comprehensive technical support, contact our manufacturing team. Our mission is to help you save costs while maintaining high-quality standards.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.