Ultra Thin FR4 Multi-Layer PCB for Memory Card Encapsulation - 0.29mm Thickness, 1mil Line Width
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Ultra Thin FR4 Multi-Layer PCB for Memory Card Encapsulation
Product Applications
Memory cards, MicroSD cards, MicroTF cards, semiconductor packaging, IC assembly, IC substrates, wearable electronics, NAND/Flash memory packages
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customizable) |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green (standard), customizable colors (TAIYO INK brand) |
Manufacturing Capabilities
HOREXS-Hubei Manufacturing Facility:
- 60,000 square meters facility in Huangshi City, Hubei Province
- $300 million USD investment
- Annual IC Substrate Capacity: 600,000 SQM
- Tenting & SAP process technologies
- Advanced capabilities: L/S 20/20μm, 10/10μm
- BT+ABF material processing
Inquiry Requirements
For accurate quotations and production planning, please provide:
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
Technical Support
HOREXS provides comprehensive technical support for high-volume customers, including design optimization and cost-saving solutions while maintaining premium quality standards.
Shipping & Logistics
DHL, UPS, FedEx, air freight, and customized express services available.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu