2 Layer High TG 170 FR4 0.35mm High Precision Coil PCB with 12μm Copper and 10/10μm Line Width
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
This 2-layer high-precision coil PCB features a 0.35mm ultrathin FR4 substrate with high TG 170 rating and flame retardant properties. Designed for demanding electronic applications requiring exceptional dimensional stability and thermal performance.
Applications
- Consumer electronics
- Digital electronics
- Various electronic devices
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.15mm |
| Raw Materials | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 |
| Soldermask/PSR | Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700,300 series |
Manufacturer Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer in China. Located in Huangshi City, Hubei Province, the facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters utilizing tenting and SAP processes. The company specializes in advanced technologies including 20/20μm and 10/10μm line/space capabilities with BT+ABF materials.
Frequently Asked Questions
Where is HOREXS company located?
HOREXS Group operates two factories: one in Huizhou City, Guangdong, and another in Hubei Province.
Does HOREXS have minimum order requirements?
No minimum order quantity or minimum order value requirements.
Can HOREXS handle large volume production?
Yes, with production capacities of 15,000 sqm/month at the old factory and 50,000 sqm/month at the new facility.
What is needed for quotation requests?
Gerber files, production specifications, buildup/stackup information for multilayer substrates, and any additional relevant documentation.
Does HOREXS support FCBGA package substrates?
FCBGA substrate manufacturing is planned for implementation in 2024 or 2025.
Contact Information
Contact Person: AKEN
Email: akenzhang@horexspcb.com
Support includes roadmap files, design rules, and production capability documentation.
Email: akenzhang@horexspcb.com
Support includes roadmap files, design rules, and production capability documentation.
Shipping Options
- DHL / UPS / FedEx
- Air Freight / Sea Freight
- Custom Express Services
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu