eMMC IC Package Substrate PCB - 0.2mm FR4 BGA with 1mil Line Width for Semiconductor Assembly
High-precision eMMC IC package substrate PCB designed for advanced semiconductor applications. Featuring BGA technology with gold plating and 0.2mm finished thickness, these substrates are engineered for reliability in demanding electronic environments.
- Semiconductor packaging and IC substrates
- eMMC and storage IC substrates
- Wearable electronics and consumer devices
- UAV systems and smart card applications
- Sensor packages and MEMS devices
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.1-0.4mm (FR4 material) |
| Copper Weight | 0.5oz or customizable |
| Layers | 1-6 layers (customizable) |
| Surface Finish | Immersion gold (OSP/immersion silver/tin available) |
| Soldermask | Green or customizable (TAIYO INK, ABQ brands) |
Premium material brands including SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
HOREXS specializes in ultra-thin FR4 PCB manufacturing with Japanese precision equipment. Our quality yield exceeds 99.7% with advanced inspection systems including AVI, AOI, and 3 LDI machines for superior circuit accuracy.
- Complete PCB production specifications
- Gerber and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer boards
We provide worldwide shipping via DHL, UPS, FedEx, and air freight. Technical support available for large-volume customers with customized solutions to optimize cost and performance.
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