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China 30μm L/S Wire Bonding Substrate with ENIG Hard/Soft Gold Finish - 0.1-0.4mm FR4 Thickness for Semiconductor Packaging for sale

30μm L/S Wire Bonding Substrate with ENIG Hard/Soft Gold Finish - 0.1-0.4mm FR4 Thickness for Semiconductor Packaging

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
Product Overview
Advanced wire bonding substrate with 30μm line/space capability, featuring UL-certified ENIG surface finish with hard and soft gold options for high-reliability semiconductor packaging applications.
Applications
  • Memory package substrates
  • DRAM/SSD/LPDDR package substrates
  • Semiconductor packaging
  • Memory packaging substrates
Technical Specifications
Parameter Specification
Minimum Line/Space 1 mil (25μm)
Finished Thickness FR4 (0.1-0.4mm)
Copper Weight 0.5oz or Custom
Layer Count 1-6 Layers (Customizable)
Soldermask Green or Custom (TAIYO INK, ABQ brands)
Tenting Process 20/20μm improved capability
Material Options
Primary brands: SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others
Surface Finishes
Mainly immersion gold (ENIG), ENEPIG, with customization options including OSP, immersion silver, tin, and more
Manufacturer Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with 60,000 square meters of facility space and over $300 million USD investment. Annual production capacity reaches 600,000 square meters with advanced Tenting & SAP processes.
Advanced Technology Capabilities
  • L/S 20/20μm and 10/10μm precision
  • BT+ABF material compatibility
  • Wire bonding substrates (BGA)
  • Embedded memory IC substrates
  • MEMS/CMOS modules
  • RF, Wireless, Bluetooth modules
  • 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
  • Buildup technology with buried/blind vias
  • Flipchip CSP and other ultra IC package substrates
Inquiry Requirements
  • Complete substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Shipping & Support
Global shipping via DHL, UPS, FedEx, and air freight. Technical support available for high-volume customers with mission to deliver cost savings without compromising quality.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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