BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging

Price Negotiable

Price: US 120-150 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

Product Description

BT FR4 NAND Memory Substrate Board

Advanced IC Substrate Solution: 35/35μm line spacing, 4-layer ENEPIG surface finish for high-performance memory packaging applications including DRAM, SSD, and LPDDR.

Product Specifications

Parameter	Specification
Line Space/Width	1mil (25μm) minimum
Finished Thickness	FR4 (0.1-0.4mm)
Copper Weight	0.5oz or customizable
Layer Count	1-6 layers (customizable)
Surface Finish	ENEPIG (Immersion Gold), OSP, Immersion Silver/Tin options available
Soldermask	Green standard, customizable colors (TAIYO INK, ABQ brands)
Tenting Process	Improved 20/20μm

Material Options

Primary Brands: SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki
Specialty Materials: OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic

Manufacturing Capabilities

Factory Size: 60,000 square meters facility
Annual Capacity: 600,000 SQM IC substrates
Advanced Technology: L/S 20/20μm, 10/10μm, BT+ABF materials
Process Support: Tenting & SAP processes

Application Support

Wire bonding substrates (BGA)
Embedded memory IC substrates
MEMS/CMOS modules
RF, Wireless, Bluetooth modules
Flipchip CSP packaging
2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
Buildup technology with buried/blind vias

Inquiry Requirements

Substrate production specifications
Gerber files and drilling files
Quantity requirements (including samples)
Layer stack-up information for multilayer substrates

Shipping & Logistics

DHL, UPS, FedEx express delivery | Air freight services | Custom express solutions

Contact for Custom Solutions

HOREXS provides technical support and cost-effective solutions for high-volume customers. Our mission: deliver superior quality while helping you save costs.