BT FCCSP Package Substrate 3x3mm 0.3mm Thickness 25µm Line Width For Flip Chip Assembly
Price:
US 85-100 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Product Overview
This FCCSP (Flip Chip Chip Scale Package) substrate measures 3x3mm with green solder mask, specifically designed for advanced flip chip assembly applications in semiconductor packaging.
Key Features & Applications
Applications
- IC Assembly & Semiconductor Packaging
- Mobile Phones & Smart Devices
- Digital Camera Electronics
- Consumer Electronics & Computers
Technical Advantages
- Supports ultra-fine 35µm pitch for flip-chip assembly
- Thin build-up laminate for SiP applications (0.3mm thickness for 1-2-1)
- Environmentally-friendly construction (Halogen-free, Lead-free)
- Multiple surface finish options available
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25µm) |
| Finished Thickness | 0.3mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, Immersion silver, tin (customizable) |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 1-6 layers (customizable) |
| Solder Mask | Green (standard), customizable (Brands: TAIYO INK, ABQ) |
Manufacturer Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer in China with over 60,000 square meters of production space and $300 million USD investment. Annual production capacity reaches 600,000 square meters using Tenting & SAP processes. The company specializes in advanced technologies including L/S 20/20µm, 10/10µm, and supports both BT and ABF materials for various IC packaging applications.
Inquiry Requirements
For accurate quotation and production planning, please provide:
- Complete substrate production specifications
- Gerber files and drilling files from your layout software
- Quantity requirements including sample quantities
- For multilayer substrates: layer stack-up/build-up information
Shipping & Logistics
We support worldwide shipping via DHL, UPS, FedEx, air freight, and customized express services to ensure timely delivery to your facility.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu