HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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16 Years
Since 2010
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4-Layer SiP Package Substrate with 25μm Line Width and 0.22mm Thickness for Heterogeneous System Integration

Price Negotiable
Price: US 99-120 each piece
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
SiP Package Substrate Overview
SiP (System in Package) substrates enable integration of multiple active devices with different functions into a single package, providing comprehensive system or sub-system capabilities. This advanced packaging technology delivers high performance and superior electrical characteristics through short interconnection paths.
Applications
  • Semiconductor and IC package substrates
  • Wearable electronics and IoT devices
  • Foldable smart mobile devices
  • Camera modules and image sensors
  • RF components and touch panel sensors
  • Storage IC substrates and various controllers
SiP Package Substrate technical diagram showing stack via and via filling technology
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Stack Via/Via Filling Supported
Finished Thickness 0.22mm
Material Brands SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish Immersion gold (standard), OSP, immersion silver, tin (customizable)
Copper Weight 0.5oz or customizable
Layer Configuration 4 layer (1+n+1 structure)
Process Technology Tenting-RCC/SAP
Soldermask Green standard, customizable (TAIYO INK brand)
Manufacturer Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer in China. Located in Huangshi city with over 60,000 square meters of production space and $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes. Advanced capabilities include L/S 20/20μm, 10/10μm, BT+ABF materials, and support for various packaging technologies.
Inquiry Requirements
  • Complete substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Technical Support
HOREXS provides comprehensive technical support for high-volume customers, helping optimize costs while maintaining premium quality standards.
Shipping Options
DHL, UPS, FedEx, air freight, and customized express services available.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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