FCCSP/FCBOC Package Substrate for PC/Server DRAM & SRAM/LPDDR - 0.25mm Thickness, 1-6 Layers
Price:
US 85-100 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Product Overview
High-performance FCCSP/FCBOC package substrate designed for PC/server DRAM and SRAM/LPDDR applications. This advanced substrate supports various IC packaging technologies including PBGA and CSP configurations.
Applications
Ideal for IC assembly in smart mobile devices, notebook PCs, video cameras, PLDs, microprocessors, controllers, gate arrays, memory, DSPs, mobile phones, smartphones, digital camera electronics, semiconductor packages, consumer electronics, computers, and networking applications including Bluetooth and RF modules.
PBGA Package Features
Plastic Ball Grid Array (PBGA) connects chips to substrates using plastic-type molding compound encapsulation. Solder balls are placed partly or entirely in lattice-shaped patterns with the following specifications:
| Parameter | Specification |
|---|---|
| Substrate Layers | 2-4 layer structure |
| Solder Ball Pitch | 1.0-1.5mm |
| Solder Ball Count | Up to 1156 balls |
| Package Size | 13-40mm |
| Impedance Control | Available based on chip characteristics |
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (20/20μm, 25/25μm) |
| Finished Thickness | 0.25mm |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 1-6 layers (customizable) |
| Surface Finish | Mainly immersion gold, supports OSP/immersion silver, tin, and custom options |
| Soldermask | Green or customizable (Brands: TAIYO INK, ABQ) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, others |
Manufacturer Information
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi city, Hubei province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD.
Annual production capacity: 600,000 SQM/year using Tenting & SAP processes. Advanced capabilities include L/S 20/20μm and 10/10μm technologies with BT+ABF materials.
Inquiry Requirements
For accurate quotations and technical support, please provide:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
Shipping Options
DHL, UPS, FedEx, air freight, and customized express services available.
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu