996 Alumina Ceramic Plate

The core substrate in the field of electronic packaging has a purity of 99.6%, an adjustable thickness of 0.4-Smm, a maximum size of φ450mm, and high thermal conductivity of 27W/(m·K) and ultra-low expansion of 8.2ppm/°C, enabling high-power circuits and high-frequency devices.

Main characteristics

• High purity raw materials are used, and the product purity is high.
• High temperature tolerance is strong, and the physical and chemical properties can be maintained in a stable environment under high temperature.
• Low thermal expansion coefficient and good thermal conductivity.
• Stable dielectric properties, low loss, and high anti-puncture performance.
• Excellent surface quality, ensuring good bonding between the base plate and the attached material.

Application scenarios

• Applicable to various integrated circuit substrates
• Applicable to thick film circuit substrates
• Applicable to high power circuit substrates

Specification: