Technical Ceramic Parts
Aluminum Nitride Ceramics, with Very High Thermal Conductivity
Aluminum Nitride Ceramics Aluminum nitride (AlN) is a fine ceramic material that features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. Properties of Aluminum Nitride (AlN) High thermal conductivity High electrical insulation capacity Low thermal expansion Thermal stability and shock resistance Plasma corrosion resistance Good metallization capacity Applications of Aluminum Nitride Semiconductor
Optoelectronic Device SiC Wafer for Light Emitting Diodes
SIC Wafer Semiconductor Wafer, Inc. ( SWI ) provides high quality single crystal SiC wafer ( Silicon Carbide ) to electronic and optoelectronic industry . SiC wafer is a next generation semiconductor material , with unique electrical properties and excellent thermal properties , compared to silicon wafer and GaAs wafer , SiC wafer is more suitable for high temperature and high power device application . SiC wafer can be supplied in diameter 2 inch , both 4H and 6H SiC , N
AIN Ceramic Heater Technical Ceramic Parts Upgrade Heating System Energy-Saving
AIN Ceramic Heater Aluminum nitride is a multifunctional material most commonly used in scenarios that require high thermal conductivity and electrical insulation. This unique ability makes AIN an ideal choice for fast heating and heat dissipation. Such as aluminum nitride ceramic heaters, aluminum nitride ceramic wafer trays/ceramic chuck table, etc. Application Semi-conductor: ESC, etch, CVD, polishing machine; Medical Devices: heating and atomization; Other: used in other
Porous Ceramics
Porous ceramics Our range of porous ceramic filters is made of aluminum oxide and silicon carbide. This durable, uniform porous ceramic has an open porosity of 40-50% with a tortuous pore structure and is available in pore sizes from 1 to 100 microns. Maximum temperature Up to 1000C for porous ceramics, limited only by sealants, gaskets and/or fasteners. Corrosion resistance Porous ceramics are resistant to most acids, with the exception of hydrofluoric and phosphoric acids.
Machined Glass Ceramics
Machined Glass Ceramics Machined glass ceramics have a continuous use temperature of 800°C and a maximum temperature of 1000°C. Its coefficient of thermal expansion easily matches that of most metals and sealing glass. It is easily machined and can be turned, milled, planed, ground, bored, cut, and carved. It also offers advantages such as insulation, non-porosity, high/low temperature resistance, acid and alkali resistance, and thermal stability. Main properties of processed
Metallized ceramic insulators
Metallized ceramic insulators Metallized ceramic insulators are made from ceramics combined with thick metal films through a metallization process. This combination of ceramic and metal allows for the creation of insulators that can withstand harsh conditions and provide electrical insulation when required. Metallization specification: Molybdenum/Manganese (Mo/Mn) plating: 9–30 µm. Nickel coating thickness: 3–10 µm. Characteristics of metallized ceramic insulators: The
High-temperature ceramics
High-temperature ceramics We offer a full line of furnace hardware, components, and accessories, from heavy-duty to lightweight, to meet any application need. Our comprehensive line of furnace components provides a solution for every renovation project and can also assist in developing applications for specific design requirements. Our factory manufactures furnace components that are a vital part of every high temperature furnace. Our proprietary material formulations allow
Direct Bonded Copper Ceramic Substrate
Direct Bonded Copper Ceramic Substrate DBC ceramic substrate, short for "direct bonded copper ceramic substrate," is an advanced material consisting of a ceramic substrate (usually Al2O3 or AlN) and copper tightly bonded together through a hypoeutectic process. This unique combination of materials produces a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering. Material properties of direct bonded
Ceramic Blades
Ceramic Blades Ceramic blades are designed for high-performance and precise cutting in a variety of applications, including film and foil cutting, medical applications, and electronic component processing and assembly. Market leaders worldwide have chosen our carbide-tipped ceramic blades to enhance their applications. The benefits of our ceramic machine blades and knives include: Improved cutting performance at high temperatures. Maximum corrosion resistance Protect against
Ceramic igniters
Ceramic igniters Ceramic lighters are simply the best choice for igniting pellet and biomass burners. They use only a fraction of the energy required by hot air fans and ignition blowers and are suitable for igniting all types of fuel. They are ideal for wood pellets, wood chips, straw, corn, and more. Thanks to a significantly higher temperature—approximately twice that of traditional metal-cased lighters—ignition time is reduced to 60 seconds. This makes them significantly
Silicides Ceramics Perts
Silicides Ceramics Perts Silicides ceramics or aluminosilicate ceramics are a class of materials that include compounds based on silicon and other alloying additives. The class of materials has gained its popularity and popularity due to the relatively low cost and universal properties that satisfy many basic applications. The main materials are: Magnesium Steatite Silicate Mg3(Si4O10)(OH)2, with impurities of iron, aluminum, manganese, etc. Cordierite is an alumosilicate of
Beryllium Oxide (BeO) parts
Beryllium Oxide (BeO) parts Beryllium oxide [BeO] has a unique combination of thermal, electrical, optical and mechanical properties that are used for a wide range of applications: from thermal control systems and integrated electronics to high-temperature refractory components and nuclear reactors. Beryllium oxide has no analogues among oxide-ceramic materials in terms of thermal conductivity. BeO-based ceramics have a thermal conductivity exceeding that of many metals,
Coatings
Coatings Depending on further manipulations with metallized elements, there is often a need to apply a finishing coating. The finishing coating can perform different functions: it can be a protective coating against various influences (mechanical, exposure to humidity, etc.); be a barrier (the interface between two mutually diffusing metals); act as a coating for soldering or welding. Regardless of the chosen technology, our technologists will help you choose the finishing
AMB Technology (Active Metal Braze)
AMB Technology (Active Metal Braze) AMB (Active Metal Braze) is one of the technologies that are used in the world to create boards with thick metallization (from 127 microns). It is in the AMB technology that a solution has been found to the problem of the mismatch of the KTR of copper with a ceramic substrate, which is key in the case of DBC technology. The coordination of the KTR is achieved due to the formation of a matching layer between the conductive layer of copper
Thin-Film Technology
Thin-Film Technology The manufacture of boards using thin-film technology has today become very widespread in the production of micro- and nanoelectronics. With thin-film technology, an adhesive and basic functional layer is deposited on the ceramic base. Deposition of layers can be performed by PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition) or ALD (Atomic Layer Deposition) methods. The most commonly used PVD methods of deposition of thin films, as the
DPC technology (Direct Plated Copper)
DPC technology (Direct Plated Copper) Stapes of the technological process: 1. Formation of a thin continuous film of conductive material on a ceramic substrate. In this case, there may be holes in the substrate; 2. Applying a photoresist to the formed conductive layer; 3. Exposure and manifestation of photoresist; 4. Galvanic build-up of copper metallization of the required thickness; 5. Application of Ni-Au finish coating; 6. Removing the photoresist from the surface of the
Microwave Ceramic Substrates (With High Dielectric Constant)
Microwave Ceramic Substrates (With High Dielectric Constant) Ceramics with high dielectric permittivity include microwave ceramics, high-frequency ceramics (HF ceramics) and ultrahigh-frequency ceramics (microwave ceramics), as well as plates made of ferro-ceramic materials. Microwave ceramics is a class of materials with a dielectric constant E from 6 to 10000 and has a small tangent of the dielectric loss angle, high insulation resistance and electrical strength, high
Beryllium Oxide Ceramic Substrates (BeO)
Beryllium Oxide Ceramic Substrates (BeO) Beryllium oxide [BeO] has a unique combination of thermal, electrical, optical and mechanical properties that are used for a wide range of applications: from thermal control systems and integrated electronics to high-temperature refractory components and nuclear reactors. Beryllium oxide has no analogues among oxide-ceramic materials in terms of thermal conductivity. BeO-based ceramics have a thermal conductivity exceeding that of many
Excellent Non-Stick Properties Robotic Welding Nozzles
Excellent Non-Stick Properties Robotic Welding Nozzles Pearling of the welding spatter ensures safe processes of the highest quality. Main applications: Components for semiconductor equipment Plates, Wafer, Rings, Gas distribution plates, Nozzles Top nozzles or Baffles, Pedestal heaters, Cover plates RF windows, Crucibles Substrate Heat resistant base materials Key Features & Specifications: Utilizes hot pressing technology Up to diameter of 650mm Very low porosity High
Ceramic Electronic Components
Ceramic Electronic Components Ceramic inserts and tools ground with high precision ensure unobstructed assembly of even the smallest electronic components, both in fully automated production and for manual assembly. Electrical insulation, high wear-resistance, temperature-resistance The two most commonly used ceramic materials are 95% alumina and 9% alumina: (1)95% alumina:Because ofits excellent performance,95% aluminais widely used in grinding and polishing processes, as