Resistance High Temperature SIC Fork

Resistance High Temperature SIC Forks Core boost for semiconductor precision manufacturing.

Materials:

SiC finger (fork) Application
SiC fingers are used in automation wafer transfer equipment which has been widely applied in semiconductor, optoelectronic, solar energy industries.

SiC finger (fork) Feature requirements
1. The surface impedance can be controlled between 106~ 1082, which meet santi-ESD specifications
2. The surface is easy to clean without the problems caused by particle
3. High hardness, abrasion resistance
4. High rigidity, good shock-resisting, not easy to bend and deform for long-term using
5. Light weight, small vibration amplitude

Manufacturing processes:

Quality Control: