Aluminum Nitride Structural Parts
We uses tape casting process to produce substrates.We developed different subdivisions in order to meet different metallization requests for different applications.
1. The source quality is controlled. Froe R & D and production of raw materials to the finished ceramic products, they are self-developed and
produced.
2. Standardthermal conductivity2 175W/mk, high thermal conductivity2 200W/mk, Ultra high thermal conductivity≥230W/m-k.
3. We can provide grinding type, as-fired type, high bending tyoe, high thermal conductivity tpye, polishing type, laser scribing type and other type of substrates.
4. Varieties of matallizations: DPC, DBC, TPC, AMB, Thick Film, Thin Film.
5. Ultra thin: 0.10mm.
Characteristic:
Strength
High reliability
High insulation
Abrasionresistance
Corrosion resistant
High temperature resistance
| Technical Specifications | Unit | Parameter |
| Apperance | Color | Gray-white |
| Thermal Conductivity | (W/m·K) | ≥170 |
| Flexural Strength | (MPa) | ≥350 |
| Bulk Density | (g/cm²) | ≥3.3 |
| Warping | (~/25 (length) | 0.002-0.005 |
| Surface Roughness Ra | (µm) | 0.8 |
| Coefficient of Thermal Expansion | [20°C to 300°C] (10*/°C) | 4.6 |
| Volume Resistivity | (Ω·cm) | 1.5×10¹⁴ |
| Dielectric Strength | (KV/mm) | ≥15 |
| Dielectric Constant | [1MHz, 25°C] | 9 |
| Dielectric Loss | [1MHz, 25°C] | 4.6×10⁻⁴ |
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