Saggers for sintering electronic ceramics
Saggers for Sintering Electronic Ceramics — Product Specification & Description
1. Product Overview
Saggers for Sintering Electronic Ceramics are specialized, high-purity refractory containers designed to meet the rigorous thermal and chemical demands of firing advanced electronic components. Engineered to provide a clean, micro-environment within kilns, these saggers shield delicate electronic substrates, capacitors, and piezo-electric materials from atmosphere turbulence, cross-talk contamination, and thermal gradients. Formulated with low reactive impurities, they ensure reproducible electrical properties, consistent shrinkage, and exact phase purity during sintering.
2. Key Features & Advantages
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High Chemical Purity & Non-Contaminating: Low trace-element chemistry prevents phase alteration, surface staining, and electrical degradation of high-value electronic ceramics.
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Thermal Shock Resistance: Engineered to endure rapid heating and cooling cycles in continuous pusher furnaces and roller hearth kilns without spalling or micro-cracking.
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Exceptional Dimensional Stability: Maintains precise flatness and structural rigidity under high-temperature loads, preventing warpage or distortion of sintered green bodies.
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Non-Stick Surface Treatments: Compatible with specialized functional coatings ($Al_2O_3$, $ZrO_2$, $Y_2O_3$) to eliminate chemical bonding or sticking between workpieces and sagger walls.
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Optimized Load-Bearing Capacity: Designed with high cold crushing strength and interlocking stackable geometry to maximize furnace loading density and overall yield.
3. Material Selection & Technical Comparison
| Property / Parameter | High-Alumina Grade | Corundum-Mullite Grade | Dense Zirconia Grade |
| Material Composition | $Al_2O_3$ (95% – 99%) | $Al_2O_3$ (75% – 85%) + $SiO_2$ | $ZrO_2$ (Yttria-Stabilized) |
| Max Operating Temp | 1650°C – 1750°C | 1550°C – 1650°C | 1600°C – 1700°C |
| Bulk Density | 3.10 – 3.70 g/cm³ | 2.55 – 2.75 g/cm³ | ≥ 5.80 g/cm³ |
| Apparent Porosity | ≤ 10% (Dense) | 16% – 20% | ≤ 0.5% |
| Thermal Expansion | ~7.5 × 10⁻⁶ / K | ~5.5 × 10⁻⁶ / K | ~10.2 × 10⁻⁶ / K |
| Primary Suitability | Substrates, HTCC/LTCC | Varistors, Sensors | PZT, Lead-Sensitive Ceramics |
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