Si3N4 Silicon Nitride Ceramics

Price Negotiable

Price: Negotiation

MOQ: 1 piece

Delivery Time: 5-8 working days

Brand: ZG

Product Description

The Ceramic Material for Extreme Applications

Silicon nitrides (Si3N4) feature an excellent combination of material properties. They are nearly as light as silicon carbide (SiC), but their microstructure gives them excellent thermal shock resistance and their high fracture toughness makes them resistant to impacts and shocks.

Silicon nitride (Si3N4) has an exceptional set of properties:

high hardness;
high corrosion resistance;
low density;
stability in a wide range of temperatures;
precision machining capability.

All these combinations make the material irreplaceable in the production of corrosion-resistant, wear-resistant and heat-resistant products for a variety of industries.

Basic properties of the material

Properties	Brand of material
Composition	SN
Composition	Si3N4
Density, g/sm³	3,2-3,3
Isolated porosity, %	0
Hardness, GPa	13,5-14,0
Bending strength, MPa	280-310
Compressive strength, MPa	3700-3900
Thermal conductivity at 20-100°С, W/mK	20-30
Coefficient of linear thermal expansion at 20-1000°С, 10^-6К^-1	2,6-3,3
Maximum operating temperature °С Oxidative environment Reducing or inert environment	1200 160

The main applications are:

bearings for pumps and compressors;
ceramic plungers;
balls for ball bearings;
grinding bodies;
elements of valves and stop valves;
lining for protection from wear and corrosion;
sorting wheels of various grinding machinery;
shafts of extruders (screws), nozzles of extruders (cores);
covers and tubes of thermocouples, rods;
nozzles;
burners;
products for the paper and printing industry;
furniture and lining of furnaces;
substrates, plates;
products for the metallurgical industry.

Silicon Nitride Related Data

Main component			99%Al2O3	S-SiC	ZrO2	Si3N4
Main component			99%Al2O3	S-SiC	ZrO2	Si3N4
Physical Property	Density	g/cm3	3.9	3.1	6	3.2
	Water Absorption	%	0	0.1	0	0.1
	Sinter Temperature	°C	1700	2200	1500	1800
Mechanical Property	Rockwell Hardness	HV	1700	2200	1300	1400
	Bend Strength	kgf/mm2	3500	4000	9000	7000
	Compression Intensity	Kgf/mm2	30000	20000	20000	23000
Thermal Property	Maximum working temperature	°C	1500	1600	1300	1400
	thermal expansion coefficient 0-1000°C	/°C	8.0*10-6	4.1*10-6(0-500°C)	9.5*10-6	2.0*10-6(0-500°C)
	thermal expansion coefficient 0-1000°C	/°C	8.0*10-6	5.2*10-6(500-1000°C)	9.5*10-6	4.0*10-6(500-1000°C)
	Thermal Shock resistance	T(°C)	200	250	300	400-500
	Thermal Conductivity	W/m.k(25°C	31	100	3	25
	Thermal Conductivity	300°C)	16	100	3	25
Electrical Property	Resisting rate of Volume	◎.cm
	20°C		>1012	106-108	>1010	>1011
	100°C		1012-1013	–	–	>1011
	300°C		>1012	–	–	>1011
	Insulation Breakdown Intensity	KV/mm	18	semiconductor	9	17.7
	Dielectric Constant (1 MHz)	(E)	10	–	29	7
	Dielectric Dissipation	(tg o)	0.4*10-3	–	–	–