8 Inch Stainless Steel Wafer Dicing Ring Frame for Semiconductor Manufacturing - 6/8/12 Inch Sizes Available
Price:
$6~$8/PCS
MOQ:
500PCS(Low this QTY will charge machine-operating and injection fee)
Delivery Time:
1~2 Weeks
Brand:
Hiner-pack
Product Description
Product Overview
High-quality stainless steel wafer dicing ring frames designed for semiconductor manufacturing processes. Available in 6-inch, 8-inch, and 12-inch sizes with customizable dimensions to meet specific tool and process requirements.
Key Features & Benefits
Premium Material Construction
- Manufactured from high-grade stainless steel for exceptional durability
- Superior corrosion and wear resistance for extended service life
- Prevents contamination during wafer dicing processes
Precision Dimensions
- Available in standard 6-inch, 8-inch, and 12-inch wafer sizes
- Customizable inside and outside diameters for specific requirements
- Compatible with automated semiconductor equipment
Performance Advantages
- Protects wafer surfaces from mechanical damage during dicing
- Ensures cutting accuracy and process consistency
- Seamless integration with automated cutting equipment
- Eco-friendly manufacturing and surface lapping process
Technical Specifications
| Parameter | Specification |
|---|---|
| Product Name | 6" 8" 12" Steel Metal Wafer Frame Ring |
| Available Sizes | 6-inch, 8-inch, 12-inch |
| Surface Treatment | Lapping |
| Material | Stainless Steel |
| Key Advantage | Eco-friendly |
| Primary Application | Laboratory Equipment & Semiconductor Manufacturing |
Industrial Applications
Wafer Storage & Transportation
Safely stores and transports semiconductor wafers while protecting against damage. Enables automated loading and unloading for efficient equipment operation.
Wafer Dicing & Scribing
Provides reliable wafer fixation and positioning during dicing processes. Ensures protection from mechanical damage and contamination.
Wafer Cleaning & Wet Processing
Special materials and surface treatments prevent electrostatic interference and chemical corrosion. Maintains wafer cleanliness throughout processing.
Thin Film Deposition & Coating
Supports and secures wafers during deposition and coating processes. Ensures uniform film deposition and optimal process results.
OEM/ODM Services Available: Custom dimensions and specifications can be tailored to meet your specific semiconductor manufacturing requirements.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu