12-inch metal wafer frame ring designed for vertical stacking with wafer shipping box applications. Manufactured from premium 316L stainless steel for exceptional corrosion and high-temperature resistance in semiconductor processing environments.

• High-quality 316L stainless steel construction prevents metal contamination during wafer dicing
• Uniformly distributed fixing holes ensure superior stability and positioning accuracy
• Precision surface polishing eliminates mechanical damage to wafers
• Professional structural design optimized for 12-inch (300mm) single wafer dicing processes
• Reduces friction and contamination risk during wafer transfer between processes

Essential for semiconductor manufacturing processes including wafer storage, transport between processing stages, and research & development testing. The silver metal finish provides excellent visibility in cleanroom environments, while the round design ensures compatibility with various processing equipment.

Custom diameter and height configurations available to perfectly match your existing dicing equipment and process requirements.

Beyond standard 316L stainless steel, we offer alternative corrosion-resistant metals and engineering plastics upon request.

Our R&D team can optimize frame structure with additional fixing holes, reinforced support systems, and other enhancements to improve performance and stability.