Standard Stackable JEDEC IC Trays For BGA QFP QFN LGA PGA Tray Weight 120g - 200g
Standard Stackable JEDEC IC Trays For BGA QFP QFN LGA PGA Tray
Product Description:
One of the key features of these JEDEC IC Trays is their stackable design. This makes them ideal for use in a variety of different environments, from small-scale workshop setups to larger-scale core tray racking setups in manufacturing facilities. With a weight range of 120~200g, these trays are lightweight yet durable, providing optimal protection for your electronic components.
These JEDEC IC Trays are finished in a sleek black color, which not only looks great but also helps to protect your IC chips.
They are also incredibly easy to store thanks to their compact design, which allows you to maximize your storage space and keep your work area organized.
Overall, if you're looking for a reliable and durable tray solution for your electronic components IC chips, look no further than our JEDEC IC Trays. Whether you're working in a small-scale workshop or a larger manufacturing facility, these trays are designed to meet your needs and provide optimal protection for your valuable IC chips. So why wait? Order your JEDEC IC Trays today and start enjoying the benefits of this top-quality tray solution!
Features:
- Product Name: JEDEC IC Trays
- Material: MPPO.PPE.ABS.PEI.IDP
- Size: 322.6*135.9mm
- Tray Weight: 120~200g
- Surface Resistance: 1.0*10e4-1.0*10e11Ω
- Application: IC Packaging
Our JEDEC IC Trays are made from high-quality MPPO, PPE, ABS, PEI, and IDP materials. These trays are designed to hold electronic components ICs securely during packaging and transport, ensuring that they remain protected from damage. With a size of 322.6*135.9mm, our JEDEC IC Trays can accommodate a wide range of IC sizes and configurations. These trays weigh between 120~200g, making them lightweight and easy to handle. They have a surface resistance of 1.0*10e4-1.0*10e11Ω, which makes them ideal for use in sensitive electronic applications. Our JEDEC IC Trays are perfect for use with an Apple Tray Making Machine, and are an essential component for anyone who works with electronic components ICs.
Technical Parameters:
| Mold No. | HN24051 |
| Overall Size/mm | 322.6x135.9x7.6 |
| Material | MPPO.PPE.ABS.PEI.IDP |
Customization:
Brand Name: Hiner-pack
Model Number: JEDEC TRAY SERIES
Place of Origin: China
Certification: ISO 9001 SGS ROHS
Minimum Order Quantity: 500
Price: TBC
Packaging Details: 80~100pcs/carton
Delivery Time: 1~2 Weeks
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day
Size: 322.6*135.9mm
Surface Resistance: 1.0*10e4-1.0*10e11Ω
Tray Features: Stackable
Height: 7.62mm
Application: IC Packaging
We also offer Electronic Components IC Chips customization services to meet your unique requirements. Our Apple Tray Making Machine ensures accurate and efficient production of Electronic Components IC Chips trays.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.