Chemical Resistance And Injection Mold In Custom JEDEC Trays For Electronics Parts Packing

Product Description:

The outline dimensions of all JEDEC matrix trays are 12.7 x 5.35 inches (322.6 x 136mm). Low profile trays with thickness of 0.25-inch (6.35mm) accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. A high profile 0.40-inch (10.16mm) version is available to hold thick (high) components such as PLCC, CERQUAD, PGA (Pin Grid Arrays), modules and assemblies.

A lot of thought was put into the design of JEDEC trays. Trays are configured with flat cells in the center area to allow automated handing by vacuum pick up tools. A scalloped feature is sculpted into one side of the tray to allow the use of a pin to mechanically fix correct orientation during use. A 45-degree chamfer in one corner provides a visual indicator of Pin 1 orientation of the components mounted in the tray.

Technical Parameters:

Applications:

•  Packaging – at their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.

•  Transportation & Storage – parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.

•  Protection – JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage

•  Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor and PC board manufacturing equipment. With decades of history and familiarity, support products for JEDEC trays are widespread and global. This includes corrugated boxes, protective covers, retaining straps, modular feeders, and a wealth of industry knowledge.