Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
Menu

Black Bare Die Tray 2-4 Inch with 0.3mm Warpage Tolerance for Chip Storage and Packaging - 494 Pocket Capacity

Price Negotiable
Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
MOQ: 1000 Pcs
Delivery Time: 5~8 Working Days
Brand: Hiner-pack
Product Description
Product Overview
The Chip Tray & Waffle Pack series from Hiner-pack provides secure packaging and transportation solutions for microelectronic components including chips, dies, COG devices, and optoelectronic components. Available in multiple sizes and materials to meet diverse industry requirements.
Key Features & Benefits
  • Permanent antistatic properties compliant with ESD and RoHS environmental standards
  • Enhanced production yield and efficiency through automation compatibility
  • Stable dimensions and high precision ensure safe transportation without crushing risks
  • Dust-free cleaning packaging suitable for class 10-1000 cleanroom environments
  • Custom design styles and sizes available to meet specific customer requirements
Technical Specifications
Model HN24072
Material Options Antistatic/Conductive ABS and PC
Available Sizes 2 inches, 3 inches, 4 inches
Matrix Quantity 19×26 = 494 pieces
Pocket Dimensions 2.6 × 1.22 × 0.8mm
Warpage Tolerance Within 0.3mm
Accessories Cover/Lid, Clip/Clamp, Tyvek paper
Artwork Format PDF, 2D, 3D
Quality Assurance
Our manufacturing process begins with imported Moldflow analysis for product mold design, enabling precise control of product dimensions and flatness based on material properties, mold structure, and injection molding conditions. This ensures consistent quality that meets customer specifications.
Customization & Support
Rapid Custom Development
We deliver custom trays from concept to production within just three weeks, meeting strict quality standards for microelectronic and various industrial applications.
Our packaging trays serve multiple industries beyond semiconductors, including medical components, jewelry, watch parts, springs, screws, and other small inventory management applications. Designed for compatibility with both manual and automated handling systems.
Black bare die tray with multiple chip pockets arranged in matrix pattern Custom chip tray with protective cover and clamp system for secure transportation

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.