Precision Machining Bare Die Trays For Transport And Customized Service By Injection Moulding

Bare Die Trays, also known as waffle pack trays, are typically characterized by their thin trays that are typically 2” or 4” square in size. These trays feature a distinctive pattern of separator ribs that form pockets, giving them the appearance of a waffle.

Waffle pack chip trays are primarily used for the handling and transportation of bare die or chip scale packages (CSP). These trays typically come with simple rectangular pockets. In some cases, custom waffle pack trays are preferred for specific applications where the existing processes are designed for waffle pack configurations but require special properties such as bakeable materials or unique pocket geometry.

Features:

These die trays have been carefully designed to ensure that the materials used are capable of absorbing all the Electrostatic Discharge (ESD) that occurs during the handling and transportation of dies.

The die trays are designed to be temperature range friendly, making it easy to handle dies as they move between different processes. This ensures that the dies are always placed within the optimal temperature range.

Die trays are certified for clean room use, guaranteeing that they are 100% contaminant-free. The trays effectively absorb any electric shocks that could potentially damage the dies.

These trays come in various sizes to accommodate different types of dies, making them compatible with all die types based on the user's preferences.

Technical Parameters:

Applications:

1. The die tray is primarily utilized in the manufacturing and assembly of semiconductor dies. Semiconductor companies commonly rely on die trays to facilitate the transportation of dies between different production facilities.

2. In addition to transportation, die trays are essential for securely holding dies during testing and for storage purposes.

3. Die trays are widely accessible through semiconductor research organizations, stores, and production facilities within the industry.

4. They are mainly designed for transporting and testing prototype semiconductor dies.