Product Description:

As a leading provider in the semiconductor packaging and testing industry, our firm has innovatively crafted the Die Carrier Series, tailored to fulfill the exacting demands of advanced semiconductor manufacturing. Aligning with the worldwide Semiconductor industry towards miniaturization and heightened integration, we have thoroughly comprehended the rigorous market specifications for chip packaging solutions, resulting in a comprehensive portfolio encompassing chips of all sizes. This offering boasts permanent antistatic properties, dust resistance, and robust durability, alongside unparalleled dimensional precision.

Features:

• Product Name: Bare Die Trays
• Customizable Logo: Available
• Molding Method: Injection Moulding
• Heat Resistant: Yes
• Stackable: Yes
• Esd Protection: Yes

Applications:

♦Temporary Storage in Semiconductor Production:

During the manufacturing and packaging of semiconductor chips, it can effectively protect the chips from physical damage and electrostatic discharge, ensuring the integrity and reliability of the chips throughout the manufacturing and packaging process.

♦Chip Transportation and Distribution:

As a professional packaging container, the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.

Customization:

Brand Name: Hiner-pack

Model Number: HN25064

Place Of Origin: Shenzhen, China

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Molding Method: Injection Moulding

Heat Resistant: Yes

Packing and Shipping:

♠Product Packaging:

The Bare Die Trays are carefully placed in individual compartments within a sturdy cardboard box to ensure safe transportation.

♠Shipping:

Once packed, the Bare Die Trays are sealed and labeled for shipping. They are then securely placed in a shipping box along with any necessary packing materials to prevent damage during transit.