High Temp JEDEC Tray With ESD Protection
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
High Temp JEDEC Tray with ESD Protection
This JEDEC tray is specially designed for high-temperature semiconductor processes, including wafer baking, burn-in testing, reflow soldering, and AI chip packaging. Made from premium PEI material, it delivers exceptional dimensional stability and precise chip positioning, ensuring seamless compatibility with automated handling equipment throughout production, storage, and transportation, while effectively protecting sensitive ICs, BGA packages, and high-value AI chips from electrostatic damage.
Our JEDEC trays are manufactured in strict compliance with JEDEC industry standards, featuring ultra-low warpage and long-term dimensional accuracy even after repeated high-temperature cycles. We offer free custom design services with a 24-hour turnaround for non-standard sizes and configurations, supporting bulk orders with fast lead times to meet the production needs of semiconductor manufacturing enterprises.
Key Features/ Benefits
- Heat Resistance up to 150°C
- Stable ESD protection (1E4–1E11 Ω)
- Compatible with ASM / Advantest / YAMAHA machines
- Low Warpage & High Dimensional Stability
- JEDEC standard footprint
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 13x28=364 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
- AI chips / GPU / ASIC
- BGA / QFN / IC packaging
- Burn-in & baking process
- Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- 10+ years semiconductor packaging experience
- In-house mold design capability
- OEM & ODM customization supported
- Consistent quality and stable supply
- Daily capacity: 2000+ pcs
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu