Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable JEDEC IC Trays in Heat-Resistant MPPO for Stable Protection
JEDEC IC Tray is built for semiconductor packaging, crafted from heat-resistant MPPO material to withstand high temperatures while maintaining long-lasting structural stability. Its rigid design shields delicate ICs from shocks, dust, and moisture during storage and transport.
JEDEC IC Tray adapts to unique needs with fully customizable dimensions, cavity layouts, and branding options. Whether standard JEDEC formats or tailored configurations are required, it aligns perfectly with production and logistics workflows.
JEDEC IC Tray is trusted across semiconductor manufacturing, testing, and distribution. Its heat-resistant properties make it ideal for high-temperature processes, while its durable build ensures reliable protection throughout the entire supply chain.
Key Features/ Benefits
- Sturdy structural integrity
- Effective dust prevention
- Short delivery time and good quality.
- Heat-resistant MPPO material for high-temperature processes
Fully customizable dimensions and cavity layouts
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×8 mm | ||
| Matrix QTY | 11X3=33 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
JEDEC IC Tray is widely used in semiconductor wafer fabrication, IC testing, and final assembly lines. Its heat-resistant MPPO material makes it perfect for high-temperature processes like die attach and reflow soldering.
It also serves logistics and distribution teams, providing secure, stackable storage for finished ICs. Its customizable design ensures compatibility with automated handling systems, streamlining supply chain operations.
Customized Services
JEDEC IC Tray offers full customization for every design aspect. Adjust cavity size, pitch, and layout to match component dimensions. Add custom logos, part numbers, or anti-static markings for brand consistency.
The engineering team works closely with clients to optimize tray performance for specific applications. Whether small-batch prototypes or large-scale production runs are needed, tailored solutions enhance efficiency and protect valuable semiconductors.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu